(03) MWN - Mobile and Wireless Networking Symposium


Symposium Co-Chairs

Bruno Clerckx Imperial College London United Kingdom
Rose Qingyang Hu Utah State University USA
Honggang Wang University of Massachusetts, Dartmouth USA
Jun Zheng Southeast University P.R. China

Technical Program Committee

Mojtaba Aajami Yonsei University Korea
Atef Abdrabou UAE University UAE
Mohamed Abid Al Akhawayn University Morocco
Taufik Abrão State University of Londrina Brazil
Hossam Afifi Institut Telecom France
Toufik Ahmed University of Bordeaux-1 / CNRS-LaBRI France
Ozgur Akan Koc University Turkey
Jabran Akhtar Norwegian Defence Research Establishment (FFI) Norway
Fakhrul Alam Massey University New Zealand
Wei An Institute of Information Engineering, Chinese Academy of Sciences P.R. China
Baoming Bai Xidian University P.R. China
Katarina Balać University of Lugano Switzerland
Javier Barria Imperial College London United Kingdom
Anass Benjebbour NTT DOCOMO, INC. Japan
André-Luc Beylot University of Toulouse France
Yuanguo Bi Northeastern University P.R. China
Kaigui Bian Peking University P.R. China
Federico Boccardi Ofcom United Kingdom
Lin Cai Illinois Institute of Technology USA
Lin Cai University of Victoria Canada
Maria-Dolores Cano Universidad Politécnica de Cartagena Spain
Bin Cao Harbin Institute of Technology P.R. China
Jiannong Cao Hong Kong Polytechnic Univ Hong Kong
Sandra Céspedes Universidad de Chile Chile
Vikram Chandrasekhar Cisco Systems USA
Periklis Chatzimisios Alexander TEI of Thessaloniki Greece
Claude Chaudet Telecom Paristech France
Abdellah Chehri University of Ottawa Canada
Cailian Chen Shanghai Jiao Tong University P.R. China
Chao Chen Shanghai Jiao Tong University P.R. China
Chen Chen Samsung Mobile Solution Lab USA
He Chen The University of Sydney Australia
Ing-Ray Chen Virginia Tech USA
Jiming Chen Zhejiang University P.R. China
Lei Chen Sam Houston State University USA
Runhua Chen Datang Telecom Technology & Industry Group USA
Shanzhi Chen China Academy of Telecommunication Technology P.R. China
Wei-Peng Chen Fujitsu Laboratories of America USA
Xue Chen Utah State University USA
Yan Chen University of Maryland, College Park USA
Yu Chen Binghamton University USA
Yuanzhu Chen Memorial University of Newfoundland Canada
Yuh-Shyan Chen National Taipei University Taiwan
Wei Cheng Virginia Commonwealth University USA
Yu Cheng Illinois Institute of Technology USA
Stefano Chessa Universita' di Pisa Italy
Man Hon Cheung The Chinese University of Hong Kong Hong Kong
Sunghyun Choi Seoul National University Korea
Song Ci University of Nebraska-Lincoln USA
Domenico Ciuonzo University of Naples Federico II Italy
Bernard Cousin University of Rennes 1 France
Garth Crosby Southern Illinois University Carbondale USA
Kanapathippillai Cumanan University of York United Kingdom
Jeremiah Deng University of Otago New Zealand
Jing Deng University of North Carolina at Greensboro USA
Harpreet Dhillon Virginia Tech USA
Konstantinos Dimou Intel Labs USA
Zhiguo Ding Lancaster University United Kingdom
Mianxiong Dong Muroran Institute of Technology Japan
Zhicheng Dong Southwest Jiaotong University P.R. China
Ziqian Dong New York Institute of Technology USA
Qiang Duan The Pennsylvania State University USA
Amit Dvir Ariel University Center of Samaria Israel
Stephan Eidenbenz Los Alamos National Laboratory USA
Omar El Ayach Google USA
Khaled El-Maleh Qualcomm Inc. USA
Mohamed Eltoweissy Virginia Military Institute USA
Melike Erol-Kantarci Clarkson University USA
Lisheng Fan Shantou University P.R. China
Marwan Fayed University of Stirling United Kingdom
Lifeng Feng Beijing University of Science and Technology P.R. China
Misha Filip University of Portsmouth United Kingdom
Gabor Fodor Royal Institute of Technology (KTH) Sweden
Hacene Fouchal Université de Reims Champagne-Ardenne France
Shengli Fu University of North Texas USA
Weihuang Fu Cisco Systems USA
Jong-kae Fwu Intel Corporation USA
Jaafar Gaber UTBM France
Xiaoying Gan Shanghai Jiao Tong University P.R. China
Weihua Gao Qualcomm Inc. USA
Xiaofeng Gao Shanghai Jiao Tong University P.R. China
Ana Garcia Armada Universidad Carlos III de Madrid Spain
Alireza Ghasempour Utah State University USA
Mir Ghoraishi University of Surrey United Kingdom
Stefano Giordano University of Pisa Italy
Gaetano Giunta University of "Roma TRE" Italy
Athanasios Gkelias Imperial College London United Kingdom
Jiaqi Gong University of Virginia USA
Kannan Govindan Samsung Advanced Institute of Technology SAIT India India
Hao Guan Nokia Siemens Networks P.R. China
Mesut Guenes University of Muenster Germany
Francesca Guerriero DIMEG University of Calabria Italy
Xiang Gui Massey University New Zealand
Maxime Guillaud Huawei Technologies France
M. Cenk Gursoy Syracuse University USA
Jairo Gutierrez Auckland University of Technology New Zealand
Qi Han Colorado School of Mines USA
Zhu Han University of Houston USA
Gaoning He Huawei Technologies P.R. China
Michael Hempel University of Nebraska-Lincoln USA
Daesik Hong Yonsei University Korea
Xiaoyan Hong University of Alabama USA
I-Hong Hou Texas A&M University USA
Jia Hou Soochow University P.R. China
Weikun Hou The University of Western Ontario Canada
Hung-Yun Hsieh National Taiwan University Taiwan
Donglin Hu Auburn University USA
Jiankun Hu University of New South Wales Australia
Kun Hua Lawrence Technological University USA
Weimin Huang Memorial University Canada
Christian Ibars Intel Corporation USA
Takao Inoue National Instruments USA
Muhammad Ismail Texas A&M University at Qatar Qatar
Yusheng Ji National Institute of Informatics Japan
Anxiao Andrew Jiang Texas A&M University USA
Chunxiao Jiang Tsinghua University, Beijing P.R. China
Hai Jiang University of Alberta Canada
Hongbo Jiang Huazhong University of Science and Technology P.R. China
Meilong Jiang Huawei USA
Ming Jiang Sun Yat-sen University P.R. China
Yuming Jiang Norwegian University of Science and Technology (NTNU) Norway
Eduard Jorswieck TU Dresden Germany
Kaushik Josiam Samsung Telecommuniations America USA
Charles Kamhoua Air Force Research Laboratory USA
Lei Ke Qualcomm USA
Jamil Khan The University of Newcastle Australia
Mehdi Khandani U. of Maryland USA
Abdelmajid Khelil Huawei European Research Center Germany
Donghyun Kim North Carolina Central University USA
Younsun Kim Samsung Electronics Co., Ltd. Korea
Samad Kolahi Unitec Institute of Technology New Zealand
Ibrahim Korpeoglu Bilkent University Turkey
Marios Kountouris Huawei Technologies France
Pandelis Kourtessis University of Hertfordshire United Kingdom
Wei-Shinn Ku Auburn University USA
Parag Kulkarni Toshiba Research Europe Ltd. United Kingdom
Katsutoshi Kusume DOCOMO Euro-Labs Germany
Yu-Kwong Kwok University of Hong Kong Hong Kong
Chin-Feng Lai National Ilan University Taiwan
Heunchul Lee Modem Development, Samsung Electronics Korea
Jang-Won Lee Yonsei University Korea
Kyoung-Jae Lee Hanbat National University Korea
Xianfu Lei Southwest Jiaotong University USA
Victor Leung The University of British Columbia Canada
Changle Li Xidian University P.R. China
Hongkun Li Interdigital USA
Husheng Li University of Tennessee USA
Ming Li Utah State University USA
Ming Li University of Nevada, Reno USA
Pan Li Mississippi State University USA
Tiffany Jing Li Lehigh University USA
Xiaohang Li Purdue University USA
Xinrong Li University of North Texas USA
Xue Jun Li Auckland University of Technology New Zealand
Yang Li University of Texas at Dallas USA
Ying Li Samsung Telecommunications America USA
Zhu Li Samsung Research America USA
Hao Liang University of Alberta Canada
Bin Lin Dalian Maritime University P.R. China
Phone Lin National Taiwan University Taiwan
Xiaodong Lin University of Ontario Institute of Technology Canada
Qing Ling University of Science and Technology of China P.R. China
Chen Liu Microsoft USA
Kuang-Hao (Stanley) Liu National Cheng Kung University Taiwan
Tong Liu VMware Inc. USA
Wei Liu Huazhong University of Science and Technology P.R. China
William Liu Auckland University of Technology New Zealand
Jaime Llorca Bell Labs, Alcatel-Lucent USA
Jaime Lloret Universidad Politecnica de Valencia Spain
Pascal Lorenz University of Haute Alsace France
Malamati Louta University of Western Macedonia Greece
Kejie Lu University of Puerto Rico at Mayaguez Puerto Rico
Rongxing Lu Nanyang Technological University Singapore
Xun Luo Qualcomm, Inc USA
Shaohe Lv National University of Defense Technology P.R. China
Maode Ma Nanyang Technological University Singapore
Yao Ma Infoscitex Inc USA
Maurizio Magarini Politecnico di Milano Italy
Dario Maggiorini University of Milano Italy
Sabita Maharjan Simula Research Laboratory Norway
Toktam Mahmoodi King's College London United Kingdom
Mohamed Mahmoud Tennessee Tech University USA
Zoubir Mammeri Paul Sabatier University France
Athanassios Manikas Imperial College London United Kingdom
Guoqiang Mao The University of Technology, Sydney Australia
Maria Martini Kingston University United Kingdom
Xavier Masip-Bruin Universitat Politècnica de Catalunya Spain
Mohammad Matin Institut Teknologi Brunei Brunei Darussalam
Alexander Min Intel Corporation USA
Pascale Minet INRIA France
Jelena Mišić Ryerson University Canada
Vojislav Mišić Ryerson University Canada
Satyajayant Misra New Mexico State University USA
Nathalie Mitton Inria Lille - Nord Europe France
Hassan Moradi Qualcomm Inc. USA
Hua Mu Florida Institute of Technology USA
Amitava Mukherjee IBM India Pvt Ltd, Calcutta India
Brendan Mumey Montana State University USA
Hidekazu Murata Kyoto University Japan
Farid Naït-Abdesselam Paris Descartes University France
Enrico Natalizio Université de Technologie de Compiègne France
Petros Nicopolitidis Aristotle University Greece
Kashif Nisar University Utara Malaysia Malaysia
Chongyu Niu Harbin Engineering University USA
Huaning Niu Intel USA
Dusit Niyato Nanyang Technological University Singapore
Robert Novak RN-CI Canada
Paulo Nunes ISCTE-IUL / Instituto de Telecomunicações Portugal
Seong-Jun Oh Korea University Korea
Pasquale Pace University of Calabria Italy
Jianping Pan University of Victoria Canada
Miao Pan University of Houston USA
Apostolos Papathanassiou Intel Corporation USA
Anastasios Papazafeiropoulos Imperial College London United Kingdom
Jaehyun Park Pukyong National University Korea
Fernando Pérez-Cruz Universidad Carlos III de Madrid Spain
Narayan Prasad NEC Labs America, Princeton USA
R Venkatesha Prasad TU Delft India
Ioannis Psaras University College London United Kingdom
XueSong Qiu Beijing University of Posts and Telecommunications P.R. China
Vasanthan Raghavan Qualcomm, Inc. USA
Sayan Ray Manukau Institute of Technology New Zealand
Peter Reiher UCLA USA
Joel Rodrigues Instituto de Telecomunicações, University of Beira Interior Portugal
Roberto Rojas-Cessa New Jersey Institute of Technology USA
Beiyu Rong Marvell Semiconductor, Inc USA
Bo Rong Communications Research Center Canada Canada
Brian Sadler Army Research Laboratory USA
Oriol Sallent Universitat Politècnica de Catalunya Spain
Riri Sari University of Indonesia Indonesia
Loren Schwiebert Wayne State University USA
Michael Segal Ben-Gurion University of the Negev Israel
Srinivas Shakkottai Texas A&M University USA
Hangguan Shan Zhejiang University P.R. China
Yi Shang University of Missouri USA
Bo Sheng University of Massachusetts Boston USA
Nirmala Shenoy Rochester Institute of Technology USA
Gaotao Shi Tianjin University P.R. China
Yi Shi Intelligent Automation Inc. USA
Zhiguo Shi Zhejiang University P.R. China
Byonghyo Shim Seoul National University Korea
Shigeru Shimamoto Waseda University Japan
Kohei Shiomoto NTT Japan
Lei Shu Guangdong University of Petrochemical Technology P.R. China
Zhihui Shu University of Nebraska-Lincoln USA
Fikret Sivrikaya Technische Universität Berlin Germany
Arun Somani Iowa State University USA
Lingyang Song Peking University P.R. China
Wei Song University of New Brunswick Canada
Sun Songlin Beijing University of Posts and Telecommunications P.R. China
Tim Strayer BBN Technologies USA
Aaron Striegel University of Notre Dame USA
Zhou Su Waseda University Japan
Hongjian Sun Durham University United Kingdom
Zhi Sun State University of New York at Buffalo USA
Junichi Suzuki University of Massachusetts, Boston USA
Sanaa Taha Cairo University Egypt
Yuliang Tang Xiamen University P.R. China
Wee Peng Tay Nanyang Technological University Singapore
Arun Thapa Tuskegee University USA
Fabrice Theoleyre CNRS - University of Strasbourg France
Xiaohua Tian Shanghai Jiao Tong University P.R. China
Laura Toni EPFL Switzerland
Kamel Tourki Huawei Technologies Co. Ltd France
Duc Tran University of Massachusetts Boston USA
Le-Nam Tran Maynooth University Ireland
Alicia Triviño University of Malaga Spain
Danny Tsang HKUST Hong Kong
Charalampos Tsimenidis Newcastle University United Kingdom
Fabrice Valois INSA Lyon France
Christos Verikoukis Telecommunications Technological Centre of Catalonia Spain
Haris Volos University of Arizona USA
Beibei Wang University of Maryland USA
Bing Wang University of Connecticut USA
Feng Wang The University of Mississippi USA
Li-Chun Wang National Chiao Tung University Taiwan
Longbao Wang Missouri University of Science and Technology USA
Pu Wang Wichita State University USA
Qiang Wang Lehigh University USA
Shaoxuan Wang Facebook USA
Sherry Wang Intelligent Automation Inc (IAI) USA
Shiguang Wang University of Illinois at Urbana-Champaign USA
Shiqiang Wang Imperial College London United Kingdom
Wei Wang San Diego State University USA
Xianbin Wang Western University Canada
Xin Wang Fudan University P.R. China
Xinbing Wang Shanghai Jiaotong University P.R. China
Yu Wang University of North Carolina at Charlotte USA
Lili Wei Intel Corporation USA
Ian Wells University of Wales Trinity Saint David United Kingdom
Mi Wen Shanghai University of Electric Power P.R. China
Miaowen Wen South China University of Technology P.R. China
Christian Wietfeld TU Dortmund University Germany
Richard Wolff Montana State University USA
Adam Wolisz TUB Germany
Kai Kit Wong University College London United Kingdom
Vincent Wong University of British Columbia Canada
Isaac Woungang Ryerson University Canada
Dalei Wu The University of Tennessee at Chattanooga USA
Dan Wu Institute of Communications Engineering, PLAUST P.R. China
Dapeng Wu Chongqing University of Posts and Telecommunications P.R. China
Di Wu Imperial College London United Kingdom
Fan Wu Shanghai Jiao Tong University P.R. China
Hongyi Wu University of Louisiana at Lafayette USA
Hsiao-Chun Wu Louisiana State University USA
Jinsong Wu Universidad de Chile Chile
Jun Wu Tongji University China P.R. China
Kui Wu University of Victoria Canada
Shaoen Wu Ball State University USA
Weili Wu UT Dallas USA
Xiao Wu Southwest Jiaotong University P.R. China
Yanwei Wu Western Oregon University USA
Yueping Wu The University of Hong Kong Hong Kong
Zhiqiang Wu Wright State University USA
Minghua Xia INRS, University of Quebec Canada
Yang Xiang Deakin University Australia
Junfeng Xiao Huawei P.R. China
Liang Xiao Xiamen University P.R. China
Yang Xiao The University of Alabama USA
Ge Xiaohu Huazhong University of Science & Technology P.R. China
Linda Jiang Xie University of North Carolina at Charlotte USA
Chengwen Xing Beijing Institute of Technology P.R. China
Liudong Xing University of Massachusetts Dartmouth USA
Changqiao Xu Beijing University of Posts and Telecommunications P.R. China
Ke Xu Tsinghua University P.R. China
Xiaohua Xu Michigan Technological University USA
Yiran Xu Utah State University USA
Zhemin Xu Huawei Technologies USA
Feng Xue Intel Corporation USA
Tan Yan NEC Labs America USA
Jianjun Yang University of North Georgia USA
Qing Yang Montana State University USA
Shaoshi Yang University of Southampton United Kingdom
Tingting Yang Dalian Maritime University P.R. China
Yaling Yang Virginia Tech USA
Cenk Yetis Mevlana University Turkey
Yang Yi University of Kansas USA
F. Richard Yu Carleton University Canada
Shui Yu Deakin University Australia
Zhenhui Yuan Dublin City University Ireland
Salahuddin Zabir Orange Group Japan
Yasir Zaki New York University Abu Dhabi (NYUAD) UAE
Faouzi Zarai Sfax University Tunisia
Jie Zeng Tsinghua University P.R. China
Kai Zeng George Mason University USA
Baoxian Zhang University of the Chinese Academy of Sciences P.R. China
Chi Zhang University of Science of Technology of China P.R. China
Guanglin Zhang Donghua University P.R. China
Haijun Zhang The University of British Columbia Canada
Jianhua Zhang Beijing University of Posts and Telecommunications P.R. China
Jin Zhang South University of Science and Technology of China P.R. China
Jiucai Zhang National Renewable Energy Lab USA
Leiming Zhang Huawei Technologies Co., Ltd. P.R. China
Liqiang Zhang Indiana University South Bend USA
Sihai Zhang University of Science and Technology of China P.R. China
Yan Zhang Simula Research Laboratory and University of Oslo Norway
Yuan Zhang Southeast University P.R. China
Zhaoyang Zhang Zhejiang University P.R. China
Zhaoyang Zhang Zhejiang University P.R. China
Dongmei Zhao McMaster University Canada
Haitao Zhao National University of Defense Technology P.R. China
Hang Zhao NYU WIRELESS USA
Hang Zhao Columbia University USA
Liqiang Zhao Xidian University P.R. China
Youping Zhao Beijing Jiaotong University P.R. China
Chi Zhou Illinois Institute of Technology USA
Liang Zhou Nanjing University of Posts and Telecommunications P.R. China
Ping Zhou Qualcomm USA
Sheng Zhou Tsinghua University P.R. China
Shengli Zhou University of Connecticut USA
Xiaolin Zhou Fudan University P.R. China
Dalin Zhu NEC Laboratories China P.R. China
Xu Zhu University of Liverpool United Kingdom
Yuan Zhu Intel Corporation P.R. China