Keynotes
Keynotes For ISCE 2012
Monday - June 4, 2012 - Breakfast Keynote
Bio
Zachi Baharav, Ph.D.
Corning West Technology Center
Zachi graduated from the Technion, Israel Institute of Technology in 1998 with a doctorate in electrical engineering. He spent the next nine years working at HP/Agilent on a variety of projects including digital cameras and microwave imaging. He then moved to Synaptics where he led the exploratory research group and was introduced to the world of touch sensing. After a short stint teaching high school math, Zachi joined Corning's West Technology Center located in Palo Alto, California where his role includes research and business development. Zachi is the author of more than 30 U.S. patents and is a senior member of the Institute of Electrical and Electronics Engineers (IEEE).
Abstract
Title: “A Day Made of Glass” – A vision for an enabled future: challenges and opportunities
Presenter/Title: Zachi Baharav, Ph.D. (Researcher, Corning West Technology Center, Corning Incorporated)
Corning’s “A Day Made of Glass” video was posted to YouTube.com in February, 2011. Since then, it has been viewed more than 15 million times, received more than 8,000 comments, and about 43,000 ‘likes!’ The vision depicted in the video resonated with many viewers as it describes a not-too-far-away future that is very optimistic in nature and promises to make our lives easier.
In this talk we will describe how the vision proposed in “A Day Made of Glass” keeps on evolving, and the various technological efforts Corning and others are leading to make it a reality. We will cover various aspects of this issue ranging from the front end user interface, enabling technologies and the whole ecosystem needed to make it a reality.
Monday - June 4th - Luncheon Keynote
Scott A. Snyder, Ph.D.
Bio
Dr. Snyder is the President and Chief Strategy Officer of Mobiquity, a leader in delivering innovative wireless solutions for enterprises. He has over 24 years of experience in business leadership, strategic planning, and technology management for both Fortune 500 companies and start-up ventures. Dr. Snyder has held executive positions with several Fortune 500 companies including GE, Martin Marietta, and Lockheed Martin, has been the CEO of a leading strategic planning firm, Decision Strategies International, and has also started business ventures in software including OmniChoice, a CRM/Analytics applications provider and Strategic Radar, which provides software-based solutions for monitoring changes in the strategic environment.
Dr. Snyder has recently written a book, The New World of Wireless: How to Compete in the 4G Revolution, released on Wharton Publishing in July 2009. He is a chapter author in the books The Network Challenge: Strategy, Profit, and Risk in the Interlinked World (Wharton Publishing, 2009) and Inside the Minds: Small Business Growth Strategies: Goals for Successful CEOs (Apatore Books, December 2007) and contributed as a co-author to several future scenario studies including The Future of BioSciences 2020 and The Future of the US Energy Grid 2025 from DSI.
Dr. Snyder is a Senior Fellow in the Management Department at the Wharton School, an Adjunct Faculty Member in the School of Engineering and Applied Science at the University of Pennsylvania, and has lectured at MIT and RIT on Decision-making, Business and IT Strategy, Telecommunications, Product Design and Development, and Business Intelligence. He leads the Wireless Innovation Council made up of leading companies focused on cross-sector mobile innovation opportunities. He also sits on the Advisory Boards of Safeguard Scientific and several emerging growth companies. He holds two patents for on-line decision aids and has been quoted as a thought leader in numerous publications including the LA Times, Wall Street Journal, the Philadelphia Inquirer and the Philadelphia Business Journal. Dr. Snyder earned his BS, MS, and Ph.D. in Systems Engineering from University of Pennsylvania and has an executive degree from USC in Telecommunications Management.
Tuesday - June 5th - Breakfast Keynote
Dr. Anthony Vetro, Mitsubishi Electric Research Labs, Cambridge, USA
Bio
Anthony Vetro is a Group Manager at Mitsubishi Electric Research Labs, in Cambridge, Massachusetts. He joined Mitsubishi in 1996 and is currently responsible for research and standardization on video coding, as well as work on display processing, information security, sensing technologies, and speech/audio processing. He has published more than 150 papers and has been an active member of the MPEG and ITU-T video coding standardization committees for a number of years. He has served as editor and ad-hoc chair for several projects, including the Multiview Video Coding standard, and currently serves as Head of the US Delegation to MPEG. He also participates in 3D working groups of ATSC, SCTE and SMPTE.
Dr. Vetro is also active in various IEEE conferences, technical committees and editorial boards. Current or past roles include Editorial Board of IEEE Signal Processing Magazine, Associate Editor of IEEE Transactions on Circuits and Systems for Video Technology and IEEE Transactions on Image Processing, Chair of TC on Multimedia Signal Processing of the IEEE Signal Processing Society, Steering Committee of IEEE Transactions on Multimedia, and General Chair of ICCE 2006. He also served on the AdCom of the IEEE Consumer Electronics Society and on the Publications Committee of the IEEE Transactions on Consumer Electronics.
Dr. Vetro received the B.S., M.S. and Ph.D. degrees in Electrical Engineering from Polytechnic University, in Brooklyn, NY. He has received several awards for his work on transcoding and is a Fellow of the IEEE.
Abstract
3D Video Coding & Transmission Formats
3D video is currently being introduced to the home through various channels, including Blu-ray Disc, cable and satellite transmission, terrestrial broadcast, and streaming and download through the Internet. This talk will examine the state-of-the-art in 3D video coding and transmission, including current industry status, standardization and research issues. The various representation and coding formats for stereoscopic video that are being deployed today will be introduced. Additionally, emerging data formats that are actively under development will be discussed, including depth-based formats that aim to support future auto-stereoscopic displays. Several distribution scenarios will be analyzed including delivery over cable, terrestrial, mobile and Internet channels, as well as distribution through packaged media. The talk will conclude with a discussion of future outlooks and existing challenges with regards to 3D transmission formats and coding technology.
Tuesday - June 5th - Luncheon Keynote
David Helster, Circuits & Design, Tyco Electronics
Abstract
Evolving Architectures to Support Next Generation Serial Data Rates
Demand for data continues to push the industry to develop faster ways of transferring data. This demand for faster data transfer has pushed serial link speeds to the next level. State of the art serial links are beginning the transition from 12Gbps to 25+Gbps. IEEE, Fibre Channel, Infiniband, and the OIF are all examples of groups that are now considering serial links faster than 12Gbps. Traditional architectures have less performance margin at 25Gbps and this is driving new considerations in system architecture. The margin of traditional channel architectures will be examined at 25Gbps using a variety of channel benchmarks. Once the baseline has been established, the same channel analysis will then be applied to a number of alternative architectures to better understand how margin can be managed and improved. Alternative architectures such as orthogonal, copper cable, and optical architectures will be considered. Tradeoffs between the different interconnect schemes will be briefly discussed.
David Helster is TE Connectivity’s Global Director of Signal Integrity which includes resources in 6 countries. This group is responsible for the signal integrity design and test of all high speed products in the TE, CIS organization. After receiving his B.S.E.E. from Drexel University, Dave started his career as a Signal Integrity Engineer where he focused on high frequency measurement & characterization of components and the simulation of digital systems. Dave is also a TE Fellow with over 20 years of signal integrity experience. In addition to managing the signal integrity group, he works directly with global customers where he applies his high speed signaling technical knowledge to help customers engineer solutions.
David Helster
Circuits & Design
Tyco Electronics
Tuesday - June 5h - Banquet Dinner Keynote
Dr. Taechan Kim
Bio
Dr. Kim holds a Ph.D. in Electronics Engineering from Korea University which he obtained in 2004.Dr. Kim joined Samsung Electronics in 1985 and now is a Technical Level VP and in-charge of advanced image technology in the CIS Image Development Team. AtSamsung, he has worked on design of image signal processors and CMOS image sensors. He also worked on Samsung’s CCD Development from 1988 to 1993 and joined the CIS Image Development team in 2004.
Dr. Kim is an Executive member in IEEK (Institute of Electronics Engineers of Korea) and the Committee in IEEE ICCE (International Conference on Consumer Electronics)
Abstract
Taking your camera from the drawer: Image Sensors Challenges for the Future
The topic will cover the latest and greatest trend of cameras and their technology.
Camera history will be introduced, the be given with today's Samsung System LSI's Semiconductor Hardware Sopast and current of image sensors will be explained, and the future of image sensors will be proposed.
Brief introduction of recent image sensors will lution. While identifying Samsung System LSI's solution, topics will show the upcoming opportunities and challenges in three main subjects with their technical benefits and barriers: High resolution photo-diodes, high speed ADC’s and new experiences of Image Signal Processing. Also included are the latest feature set of CIS in its multi-generations with anticipating Image Enhancing Technology.
Wednesday - June 6th - Breakfast Keynote
Jim Nadolny
Global Signal Integrity
Bio
Jim Nadolny is the head of Global Signal Integrity for Samtec and is a frequent speaker at industry conferences. For the past several years, Jim has focused on the development of overseas test laboratories and analysis centers with the aim of enhanced technical support for customers. With 20 years in the interconnect industry, Jim has experienced the increased sophistication in signal integrity as our world consumes ever more digital content in the form of media, banking and communications. Jim has an MSEE from the University of New Mexico and has received awards for technical papers on topics ranging from appliance design to digital microwave innovations.Jim and his wife live in the Harrisburg PA area where they enjoy the beauty of Central Pennsylvania.
Abstract
Title: Connector Models: Past, Present and Future
Connector and memory sales are often considered the key barometers of the electronics industry. They are used in nearly all electronic products and their annual sales and are often precursors to trends in the industry as a whole. In this talk we will look at one interesting trend: connector model evolution. The evolution parallels the growing sophistication of signal integrity, a field which did not exist until digital electronics began to operate at “fast” speeds.
Connector models began as simple lumped element models which were adequate for nanosecond risetimes in the early 1990’s. As data rates increased and risetimes became faster, connector models grew in sophistication. Today connector models are multiport microwave networks which are analyzed with specialized software running on server farms. Measurements have always played the crucial role of validating the accuracy of models and as confidence grows in the accuracy of simulations based models, it is expected that the role of measurements will transform. The talk will conclude with a review of emerging trends and what they may mean for signal integrity in general and connector models specifically.
Wednesday
Howard Heck, Intel
Bio
Howard Heck earned the B.S.Ch.E. degree from Northwestern University in 1985, and the M.S.E.E. degree from the National Technological University in 1994. From 1985-1995 he was employed at IBM where he developed high performance printed circuit board and chip packaging technologies, including HyperBGA™ technology. Since joining Intel in 1995, he has focused on R&D of high speed inter-chip signaling solutions in both technical and management roles. He led the development team for the Pentium® II 100 MHz Frontside Bus, earning an Intel Achievement Award, and managed teams who developed technology solutions for Direct RDRAM™, DDR II, Pentium® 4 Processor Frontside Bus, and Accelerated Graphics Port (AGP) interfaces. From 2002 through 2007, He led R&D of interconnect technologies, modeling, simulation and measurement for 10+ Gb/s signaling interfaces. He currently leads development of the specifications and interconnect solutions for 5 Gb/s SuperSpeed USB 3.0 technology. From 1997 through 2009, Howard also held a position as an Adjunct Professor at the Oregon Graduate Institute, where he teaches High Speed Digital Interconnect Design. He is an IEEE Senior Member, and holds 10 patents in the area of high performance packaging and interconnects with 8 more pending. He is co-author of Advanced Signal Integrity for High-Speed Digital Designs, a graduate level SI textbook published in 2009.
Abstract
Signal Integrity in a Consumer World
The era of truly portable computing is upon us. Tablet and smart phone sales exceeded 500 million in 2011 on the way to over a billion units by 2015. As they continue to evolve, it is reasonable to expect that they will make the following a reality within the next decade: Your life is on a device that you can carry around with you. Making such a vision into reality requires the ability to store and share a variety of data – and lots of it (think photos, HD video). The growth in stored data capacity must be accompanied by higher bandwidth interconnection, perhaps as much as 10x-20x over the next decade.
In addition to the bandwidth scalability, the signal integrity challenges presented by these devices include:
• a large amount of function in a very small, thin enclosure. The signal integrity implications include crosstalk, radio frequency interference and the need for small form factor connectors.
• battery powered operation, which demands minimized power during operation and the ability to shut off features when not in use.
• development of signaling standards that provide the required performance scaling without exceeding the power envelope.
• need to interoperate with a vast array of devices (displays, PCs, hard drives, etc.), requiring the ability to accommodate a wide range of interconnect channel loss.
• exceptionally short design and validation cycles. This drives the need to design capabilities into the silicon to assess signaling link robustness.
While each of these represents a significant challenge by itself, in combination they create a dynamic optimization problem in which the optimization metric can change based upon usage.
This talk will discuss each of these challenges and offer some ideas for how we might begin to address them.