14:00-14:10 Welcome remarks: Sherry Hess
14:10-14:40 Invited Talk: Dr. Irit Idan, Executive Vice President R&D at Rafael Advanced Defense Systems
14:40-14:50 Break
14:50-15:40 Panel Discussion: Career Crossroads - Dilemmas of Women in Engineering
Panel includes: Prof. Yael Hanein, Tel Aviv University, X-trodes, Nano Retina Neta Goshen, Electrum Ltd. Dana Cohen, Tel Aviv University Moderators: Maya Shor-Peled, Esti Toledo, Alexandra Makarochkin
15:40-15:50 Concluding Remarks: Shmuel Auster
9:00 - 9:15 1 Rafael Ayelet Belous Israel ayeletb1@rafael.co.il Sealing Challenges of the Hi-End MEMS Sensors
9:15 - 9:30 2 Elbit - Elop Yuval Ulman Israel Yuval.Ullman@elbitsystems.com Design and optimization of Phase Change Material cooling solutions by utilizing 3D printing technologies
9:30 - 9:45 3 NVIDIA Marisa Sheffer Israel msheffer@nvidia.com XL Flip Chip Ball Grid Array (FCBGA) package development, challenges and solutions
9:45 - 10:00 4 Phononics Shye Shapira Israel shyesh@towersemi.com Performance Enhancement of Integrated Circuits and Power Devices via Embedded Diamond Heat Management
10:00 - 10:15 5 PCB Yaniv Maydar Israel yaniv@pcb-technologies.com SiP (System in Package) - More than Moore
10:15 - 10:30 6 ANSYS Omri Yannay Israel omri.yannay@ansys.com Process Simulation in Micro-Electrical Mechanical Systems. Structural and Thermal State During Photo-Lithography Layup of a Pirani Sensor
10:30 - 10:50 7 BGU Gennady Ziskind Israel gziskind@bgu.ac.il In memoriam - Prof. Avi Bar-Cohen
11:10 - 11:25 8 Elbit - Elop Galit Zilberman Israel galit.zilberman@elbitsystems.com From Nano to Bio - Eco Friendly coatings
11:25 - 11:40 9 Copprint Ofer Shohat Israel ofer@copprint.com Conductive Copper ink printing for the additive manufacturing of low cost and sustainable electric circuits and antennas
11:40 - 11:55 10 Nano Dimension Ziv Cohen Israel ziv@nano-di.com Additively Manufactured Electronics (AME) for multilayers applications
11:55 - 12:10 11 Rafael Ronen Maimon Israel ronenma@rafael.co.il The impact of adhesives mechanical properties on the behavior of a closed loop MEMS accelerometer
12:10 - 12:25 12 Rafael Jonathan Rothschild Israel yonathanr@rafael.co.il An empirical method for determining the reliability of die-attach joints in hybrid modules
12:25 - 12:40 13 Bar-Ilan University Doron Naveh Israel Doron.Naveh@biu.ac.il Graphene in thermal management
12:40 - 13:00 14 Technion Eilam Yalon Israel eilamy@gmail.com Sub-micron spatially resolved thermometry
14:20 - 14:35 15 BGU Oren Regev Israel oregev@bgu.ac.il Enhanced thermal management of composite materials
14:35 - 14:50 16 Mizur Technology Shay Kaplan Israel shay@mizur.com Digital Loudspeaker packaging challenges
14:50 - 15:05 17 PV Nano Cell Hanan Marcovitch Israel hanan@pvnanocell.com Digital Printed Electronics: Mass-Production Technologies & Application
15:05 - 15:20 18 ANSYS, MARVELL, INTEL Shai Sayfan-Altman Israel shai.sayfan-altman@ansys.com The Hidden Challenges in Manufacturing variations
15:20 - 15:35 19 ACT Adam F. Say USA Adam.Say@1-ACT.com A Comparison of Advanced Passive and Active Cooling Solutions on the Basis of Size, Weight and Power (SWaP)
15:35 - 15:50 20 Rafael Elad Dor Israel ELADDOR@rafael.co.il Thermal design and analysis for RPV's avionic box - challenges and solutions
15:50 - 16:10 21 Elta Michael Kedem Israel mkedem@elta.co.il Miniaturization SiP and MCM Motivation, hurdles & Implementation"