Program for CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

Time Room 1 Room 2 Session

Tuesday, March 24

10:00-10:10 Introduction    
10:10-10:50 Keynote    
10:50-11:50 Session Power Packages and Modules (1) Session Components to be integrated (1)  
11:50-13:20     Lunch Break
13:20-14:40 Session Power Packages and Modules (2) Session Components to be integrated (2)  
14:40-15:10     Tea Break
15:10-16:30 Session Power Packages and Modules (3) Session Components to be integrated (3)  
16:30-17:00     Break
17:00-18:30 Session Power Packages and Modules (4) Session Components to be integrated (4)  
19:00-21:30     Get Together

Wednesday, March 25

08:30-09:10 Keynote    
09:10-10:10 Session Power Packages and Modules/Mechatronic Systems (1) Session General Aspects of Packaging (1)  
10:10-10:40     Tea Break
10:40-12:20 Session Power Packages and Modules/Reliability(2) Session Clean Switching, EMC (1)  
12:20-13:50     Lunch Break
13:50-16:30     Poster Session + Tea Break,
Poster Session Clean Switching, EMC,
Poster Session Components to be Integrated,
Poster Session General Aspects of Packaging,
Poster Session Mechatronic Systems and their Applications,
Poster Session Power Packages and Modules,
Poster Session Reliability
16:30-18:00 Session Reliability (1) Session Clean Switching, EMC (2)  
19:00-22:00     Conference Dinner (Departure from the Venue by Bus)

Thursday, March 26

08:30-09:10 Keynote    
09:10-10:10 Session Reliability (2) Session General Aspects of Packaging (2)  
10:10-10:40     Tea Break
10:40-12:00 Session Reliability (3) Session General Aspects of Packaging (3)  
12:00-13:30     Lunch Break
13:30-14:10 Keynote    
14:10-15:00 Closing and Awards Ceremony    

Tuesday, March 24

Tuesday, March 24 10:00 - 10:10

Introductiongo to top

Room 1
Chairs: Nando Kaminski (University of Bremen, Germany), Andreas Lindemann (University of Magdeburg, Germany)

Tuesday, March 24 10:10 - 10:50

Keynotego to top

Room 1
Chairs: Nando Kaminski (University of Bremen, Germany), Andreas Lindemann (University of Magdeburg, Germany)
10:10 Wide-Bandgap Semiconductor Power Electronics: Overcoming Barriers in Materials to Circuits for a more Electrified Future
Isik C. Kizilyalli (Advanced Research Projects Agency – Energy (ARPA-E), USA); Eric Carlson (Booz Allen Hamilton, USA); Daniel Cunningham (Advanced Research Projects Agency - Energy (ARPA-E), USA)

Tuesday, March 24 10:50 - 11:50

Session Power Packages and Modules (1)go to top

Room 1
10:50 Design innovations and performance of GaN Power Modules and MCMs
Charles Bailley (GaN Systems Inc., USA)
11:10 Evaluation of a GaN HEMT half-bridge embedded to a Multilayer Aluminum Nitride Substrate
Carsten Kuring (Technische Universität Berlin, Germany); Mihaela Wolf (Ferdinand-Braun-Institut Leibniz-Institut für Höchstfrequenztechnik, Germany); Xiaomeng Geng (Technische Universität Berlin, Germany); Oliver Hilt (FBH, Germany); Jan Böcker and Nick Wieczorek (Technische Universität Berlin, Germany); Joachim. Wuerfl (Ferdinand-Braun-Institut, Germany); Sibylle Dieckerhoff (TU Berlin, Germany)
11:30 Surface-Mount Package IPM with Highly Reliable Transfer Molding Resin
Hodaka Rokubuichi (Mitsubishi Electric Corporation, Japan)

Session Components to be integrated (1)go to top

Room 2
10:50 Simple and Precise Calorimetry Method for Evaluation of Losses in Power Electronic Converters
Nicolas Mary (Mitsubishi Electric R&D Centre Europe, Laboratoire Ampère, France); Rémi Perrin and Stefan Mollov (Mitsubishi Electric R&D Centre Europe, France); Cyril Buttay (Université de Lyon Laboratoire Ampere CNRS UMR 5005 & Insa de Lyon, France)
11:10 Experimental Study of the Coss-Losses Occurring During ZVS Transitions - Emphasis on Low and High Voltage GaN-HEMTs
Benedikt Kohlhepp, Daniel Kübrich and Thomas Dürbaum (Friedrich-Alexander University Erlangen-Nürnberg (FAU), Germany)
11:30 Implementation and validation of a dynamic calorimetric method to evaluate the losses in switching discrete power MOSFETs
Do Phuong Uyen Tran (G2Elab, France); Stephane Lefebvre (SATIE, ENS-CACHAN, France); Yvan Avenas (Grenoble Université, France)

Tuesday, March 24 11:50 - 13:20

Lunch Breakgo to top

Tuesday, March 24 13:20 - 14:40

Session Power Packages and Modules (2)go to top

Room 1
13:20 Is Pressureless Sintering Ready for Power Electronic Modules?
Thomas Blank, Matthias Mail, Marc Weber, Helge Wurst, Bao Ngoc An and Benjamin Leyrer (Karlsruhe Institute of Technology, Germany)
13:40 Comparison of Silver Sintered Assemblies on Non-DCB Substrates
Nilavazhagan Subbiah (University of Freiburg & IMTEK, Germany); Alexander Schiffmacher (University of Freiburg - IMTEK, Germany); Jürgen Wilde (Universität Freiburg - IMTEK, Germany); Xiayingfang Song (University of Freiburg, Germany)
14:00 Sintered-copper Die-attach: Processing, Properties, and Reliability
Meiyu Wang, Yanliang Shan, Yun-Hui Mei and Xin Li (Tianjin University, China); Guo-Quan Lu (Virginia Tech & NBE Technologies, LLC, USA)
14:20 Thick film paste systems for multifunctional copper power modules
Kathrin Reinhardt and Stefan Körner (Fraunhofer Institute of Ceramic Technologies and Systems, Germany); Uwe Partsch (Fraunhofer Institute Ceramic Technologies and Systems, Germany)

Session Components to be integrated (2)go to top

Room 2
13:20 Monolithic Integration of Inductive Components in a GaN-on-Si Technology
Michael Basler (Fraunhofer Institute for Applied Solid State Physics, Germany); Stefan Moench (Fraunhofer IAF, Germany); Richard Reiner (IAF Fraunhofer, Germany); Patrick Waltereit and Rüdiger Quay (Fraunhofer IAF, Germany); Ingmar Kallfass (University of Stuttgart, Germany); Oliver Ambacher (Fraunhofer IAF & IMTEK, University Freiburg, Germany)
13:40 A 600 V GaN-on-Si Power IC with Integrated Gate Driver, Freewheeling Diode, Temperature and Current Sensors and Auxiliary Devices
Stefan Moench (Fraunhofer IAF, Germany); Richard Reiner (IAF Fraunhofer, Germany); Patrick Waltereit (Fraunhofer IAF, Germany); Jan Hückelheim (University of Stuttgart, Germany); Dirk Meder and Rüdiger Quay (Fraunhofer IAF, Germany); Oliver Ambacher (Fraunhofer IAF & IMTEK, University Freiburg, Germany); Ingmar Kallfass (University of Stuttgart, Germany)
14:00 Novel back-end-of-line compatible method for integration of inductances with magnetic core on silicon
Malte Paesler, Thomas Lisec and Holger Kapels (Fraunhofer Institute for Silicon Technology, Germany)
14:20 Ultra-low loss integrated magnetics platform for high frequency power delivery networks
Pranay Podder (Tyndall National Institute, University College Cork, Ireland); Zoran Pavlovic, Ansar Masood, Guannan Wei, Daniel Lordan and Seamus O'Driscoll (Tyndall National Institute, Ireland); Lulu Peng, Zishan Ali, Lawrence Selvaraj and Chor Shu Cheng (GlobalFoundries Corporation, Singapore); Cian Ó Mathúna and Paul McCloskey (Tyndall National Institute, Ireland)

Tuesday, March 24 14:40 - 15:10

Tea Breakgo to top

Tuesday, March 24 15:10 - 16:30

Session Power Packages and Modules (3)go to top

Room 1
15:10 Thermal analysis of power module with double sided direct cooling using ceramic heat sinks
Nicolas Botter (University of Grenoble & Safran Tech, France); Yvan Avenas, Jean-Michel Missiaen and Didier Bouvard (Grenoble Université, France); Rabih Khazaka (Safran SA, Safran Tech, France)
15:30 High Performance Power module with double side cooling for automotive
Junhee Park (Hyundai Motors, South Korea)
15:50 Low voltage switching cell for high density and modular 3D power module with integrated air cooling
16:10 Direct heat sink printing on metallized ceramic substrate for power electronics applications: heat treatment identification and its im-pacts
Rabih Khazaka (Safran SA, Safran Tech, France); Elodie Martin and Joel Alexis (LGP, INP-ENIT, France); Donatien Martineau (Safran, France); Stephane Azzopardi (Safran SA, France)

Session Components to be integrated (3)go to top

Room 2
15:10 Dynamic Current Balancing of Parallel Connected IGBT Devices using PCB Sensors for Integration in Power Modules
Ravi Nath Tripathi (Kyushu Institute of Technology, Japan); Masanori Tsukuda (Green Electronics Research Institute, Kitakyushu, Japan); Ichiro Omura (Kyushu Institute of Technology, Japan)
15:30 Detecting Three-Phase Power Inverter Output Currents By A Single PCB Current Sensor
Bat-Otgon Bat-Ochir (Kyushu Institute of Technology, Japan)
15:50 Three-State Output Gate Driver for IGBTs
Paula Diaz Reigosa (University of Applied Sciences, Windisch, Switzerland); Bogdan Marian Urcan (Aalborg Universtiy, Denmark); Martin Iriondo Gascue (Alaborg University, Denmark); Francesco Iannuzzo (Aalborg University, Denmark)
16:10 Optimisation and Application Studies for the M-Shunt Structure applied to Printed Circuit Boards
Hauke Lutzen (University of Bremen, Germany); Koji Mitsui and Keiji Wada (Tokyo Metropolitan University, Japan); Nando Kaminski (University of Bremen, Germany)

Tuesday, March 24 16:30 - 17:00

Breakgo to top

Tuesday, March 24 17:00 - 18:30

Session Power Packages and Modules (4)go to top

Room 1
17:00 The Opportunities of Integration Technologies for Active and Passive Components (Invited)
Andreas Ostmann (Fraunhofer IZM, Germany)
17:30 System integration and analysis of SiC-based high power inverter with up to 250 kW and switching slopes of up to 50 kV/µs for novel powertrain concepts
Christian Meyne (Infineon Technologies AG, Germany); Alexander Otto and Sven Rzepka (Fraunhofer ENAS, Germany); Omar Vanegas and Lea Fuchs (Infineon Technologies AG, Germany); Christoph Luedecke (ISEA RWTH-Aachen, Germany); De Doncker Rik W. (RWTH Aachen University, Germany); Christian Strenger (Infineon Technologies AG, Germany); Thomas Reum (CE-LAB GmbH, Germany); Alexander Nisch, Maximilian Hepp and Wolfgang Wondrak (Daimler AG, Germany); Andre Uhlemann (Infineon Technologies AG, Germany)
17:50 Thermally Integrated 3D Package for SiC Based DC-DC Full Bridge Converter
18:10 A low inductive PSiP packaging technology with multilayer ceramic substrate and integrated active cooling (Invited)
Karsten Schmidt, Olivier Mathieu, Tilo Welker and Andreas Meyer (Rogers Germany GmbH, Germany)

Tuesday, March 24 17:00 - 18:20

Session Components to be integrated (4)go to top

Room 2
17:00 Challenges and opportunities for magnetic components in the low to medium power applications (Invited)
Marek S. Rylko (SMA Magnetics Sp. z o. o., Germany)
17:30 PCB Embedded dies for low thickness Wireless rotary transformer
Rémi Perrin (Mitsubishi Electric R&D Centre Europe, France); Julien Morand (Mitsubishi Electric Research, France); Guilherme Bueno Mariani and Stefan Mollov (Mitsubishi Electric R&D Centre Europe, France)
17:50 Integration of Printed Electronics in Potted Power Electronic Modules
Victoria Zimmermann (Fraunhofer Institute for Integrated Systems and Device Technology, Germany); Alicia Zoerner (Fraunhofer IISB, Germany); Zechun Yu (Fraunhofer Institute for Integrated Systems and Device Technology IISB, Germany); Michael Jank (Friedrich-Alexander Universität Erlangen-Nürnberg, Germany); Christoph Friedrich Bayer (Fraunhofer Institute for Integrated Systems and Device Technology, Germany); Andreas Schletz (Fraunhofer Institute for Integrated Systems and Device Technology IISB, Germany); Martin März (FhG Erlangen, Germany)
18:10 SiC Power Module with integrated RC-Snubber Design for Voltage Overshoot and Power Loss Reduction
Cornelius Rettner and Maximilian Schiedermeier (Friedrich-Alexander-University Erlangen-Nürnberg, Germany); Andreas Apelsmeier (Friedrich-Alexander-University Erlangen-Nuremberg, Germany); Thomas Heckel (Friedrich-Alexander University Erlangen-Nürnberg (FAU), Germany); Antonia Diepgen (Fraunhofer Institute for Integrated Systems and Device Technology, Germany); Alexander Klische (Fraunhofer Institute of Integrated Systems and Device Technology, Germany); Daniel Dirksen (Fraunhofer Institute for Integrated Systems and Device Technology, Germany); Martin März (FhG Erlangen, Germany)

Tuesday, March 24 19:00 - 21:30

Get Togethergo to top

Wednesday, March 25

Wednesday, March 25 8:30 - 9:10

Keynotego to top

Room 1
Chair: Regine Mallwitz (Technische Universität Braunschweig, Germany)
8:30 Capacitor-Based Power Converters for High Power Density and Efficiency - the Theoretical Promises and Practical Challenges
Robert Pilawa (University of California Berkeley, USA)

Wednesday, March 25 9:10 - 10:10

Session Power Packages and Modules/Mechatronic Systems (1)go to top

Room 1
9:10 Full-SiC Integrated Power Module based on Planar Packaging Technology for High Efficiency Power Converters in Aircraft Applications
Oliver Raab (Siemens AG, Germany); Mattia Guacci (ETH Zurich, Switzerland); Antonio Griffo (The University of Sheffield, Great Britain); Kai Kriegel (Siemens AG, Germany); Morris Heller (ETH Zurich, Switzerland); Jiabin Wang (The University of Sheffield, Great Britain); Dominik Bortis (ETH Zurich, Switzerland); Martin Schulz (Siemens AG, Germany); Johann. W. Kolar (ETH Zurich, Switzerland)
9:30 Cooling Jacket Design for High Power Electric Smart Motor
Zhaoxi Yao, Yonatan Saadon, Raphael Mandel and Patrick McCluskey (University of Maryland, USA)
9:50 Multi-chip Medium Voltage SiC MOSFET Power Module with Focus on Low Parasitic Capacitance

Session General Aspects of Packaging (1)go to top

Room 2
9:10 Ultra-high power density server supplies employing GaN power semiconductors and PCB-integrated Magnetics (Invited)
Matthias J. Kasper, Luca Peluso and Gerald Deboy (Infineon Technologies Austria AG, Austria); Gustavo Knabben (ETH Zurich, Switzerland); Guillod Thomas (Swiss Fed Inst Technol, Switzerland); Johann. W. Kolar (ETH Zurich, Switzerland)
9:40 WBG power semiconductor packaging with advanced interconnection technologies (Invited)
Katsuaki Suganuma (Osaka University, Japan)

Wednesday, March 25 10:10 - 10:40

Tea Breakgo to top

Wednesday, March 25 10:40 - 12:20

Session Power Packages and Modules/Reliability(2)go to top

Room 1
10:40 Improvement of High-temperature Reliability of Power Modules by Multi-step Temperature Bonding Process of Zn-Al Solder
Hiroshi Hozoji, Fumiki Kato, Hiroshi Sato, Shinji Sato and Hiroshi Yamaguchi (National Institute of Advanced Industrial Science and Technology, Japan)
11:00 SiCmodul - Modular high-temperature SiC power electronics for fail-safe power control in electrical drive engineering
Christoph Marczok (Fraunhofer IZM, Germany); Manuel Martina (Schweizer Electronic AG, Germany); Michael Laumen (RWTH Aachen University, Germany); Sebastian Richter (AixControl GmbH, Germany); Oliver Wendt (TLK Thermo GmbH, Germany); Andreas Birkhold (Robert Bosch GmbH, Germany)
11:20 Power Cycling Reliability and Failure Modes in Power Modules with Novel Emitter Contact and Sintering Technologies
Harald Beyer (ABB Switzerland Ltd., Switzerland); Milad Maleki (ABB Semiconductors Ltd., Switzerland); Martin Bayer (ABB Switzerland Ltd., Switzerland); Swen König and Fabian Fischer (ABB Semiconductors Ltd., Switzerland); Gontran Paques (ABB Switzerland Ltd., Switzerland)
11:40 Power Cycle Testing at Low Temperature Swings - Evaluating the Stability of SAC- and SnSb-based Chip Solder Layers

Session Clean Switching, EMC (1)go to top

Room 2
10:40 Reduction of Common Mode EMI noise in microstrip line based commutation paths designed for sub-nH loop inductance
Norbert Seliger and Eduard Dechant (Technische Hochschule Rosenheim, Germany); Christian Brendel (Dr Johannes Heidenhain GmbH, Germany); Ralph Kennel (Technical University of Munich, Germany)
11:00 Impact of multilevel converters on EMC filter weight of a 70 kVA power drive system for More Electrical Aircraft
Hans Hoffmann Sathler (IRT Saint-Exupery, France); Bernardo Cougo and Lucas Nagano (IRT Saint Exupery, France); Francois Costa and Denis Labrousse (SATIE, France)
11:20 Control scheme for EMI reduction via spread spectrum modulation for triangular current mode (TCM) DC/DC converters
Burkhard Ulrich (University of Cooperate Education Baden-Wuerttemberg (DHBW) Stuttgart Campus Horb, Germany)
11:40 EMI Imaging System Using Double-pulse-compose-method
Kota Matsuo (Kyushu Institute of Technology & Omura Laboratory, Japan); Masanori Tsukuda (Green Electronics Research Institute, Kitakyushu, Japan); Ichiro Omura (Kyushu Institute of Technology, Japan)
12:00 Gallium Nitride in Automotive High-Speed Drive Applications
Benjamin Antensteiner (Magna Powertrain, Austria); Patrick Lamplmayr (MAGNA ECS, Austria); Michael Moerwald (Magna Powertrain, Austria); Lukas Haeusler (Magna Powertrain Engineering Center Steyr GMBH & CO KG, Austria); Wolfgang Gruber (Johannes Kepler University Linz & Institute for Electrical Drives and Power Electronics, Austria); Martin Reisinger (Linz Center of Mechatronics GmbH, Austria)

Wednesday, March 25 12:20 - 13:50

Lunch Breakgo to top

Wednesday, March 25 13:50 - 16:30

Poster Session + Tea Breakgo to top

Poster Session Clean Switching, EMCgo to top

Analysis of the gate driver stray inductance in a Vienna rectifier through parametric Electromagnetic simulations
Francesco Palomba (Keysight Technologies Italy, Italy); Francesco Gennaro, Mario Pavone and Giuseppe Aiello (STMicroelectronics, Italy); Mario Cacciato (Università degli Studi di Catania, Italy); Simon Muff (Keysight Technologies, Germany); Ludwig Eichinger (Keysight Technologies Deutschland GmbH, Germany)
Investigation of the Current Ripple caused by the Main Inverter in the High Voltage DC Bus of Electric Vehicles
Marius Gentejohann and Michael Schlüter (Technische Universität Berlin, Germany); Sibylle Dieckerhoff (TU Berlin, Germany)
Low-Inductance DC-link Design dedicated to SiC-based Highly Integrated Inverters
Jasper Schnack (Fachhochschule Kiel, Germany); Jan Philipp Gördes and Victor Golev (University of Applied Sciences Kiel, Germany); Ulf Schümann (Fachhochschule Kiel, Germany); Stefan Stahl and Herwig Süncksen (FTCap GmbH, Germany); Regine Mallwitz (Technische Universität Braunschweig, Germany)
Operating a du/dt Filter with a SiC Halfbridge Module and Integrated Active Snubber
Michael Schlüter (Max-Planck-Strasse 5 & Infineon Technologies AG, Germany); Martin Pfost (TU Dortmund, Germany)
Electromagnetic switching cell design and characterization for WBG power semiconductors
Kirill Klein (Technical University Berlin, Germany); Eckart Hoene (Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM, Germany); Klaus-Dieter Lang (Technische Universität Berlin, Germany)
Switching speed evaluation of e-mode GaN HEMTs in ultra-low inductive switching cell designs
Raffael Risch, Anliang Hu and Jürgen Biela (ETH Zurich, Switzerland)
Performance of the FIR filter based damping of 1MHz GaN paralleled half-bridge converter
Nikola Boskovic (Eindhoven University of Technology, The Netherlands)
Wideband Macro-Modeling of Power Modules for Transient Electro-magnetic Analysis
Arne Schröder (ABB Switzerland); Bernhard Wunsch (ABB Switzerland Ltd, Switzerland); Slavo Kicin (ABB Corporate Research Centre, Switzerland)

Poster Session Components to be Integratedgo to top

Thin-film magnetics-on-silicon integrated transformer for isolated power conversion applications
Zoran Pavlovic, Paul McCloskey and Cian Ó Mathúna (Tyndall National Institute, Ireland); Pranay Podder (University College Cork & Tyndall National Institute, Ireland); Seamus O'Driscoll (Tyndall National Institute, Ireland)
Digital Gate Drive Control Method for Active Voltage Balancing of Series-connected IGBT Devices
Ravi Nath Tripathi and Takaaki Arimoto (Kyushu Institute of Technology, Japan); Masanori Tsukuda (Green Electronics Research Institute, Kitakyushu, Japan); Ichiro Omura (Kyushu Institute of Technology, Japan)
Ultra-Compact Combined Common Mode (CM)- and Differential Mode (DM)-Inductors
Patrick Deck, Martin Nießen and Christian Dick (TH Köln, Germany)
PCB Embedded Toroidal Inductor for 2MHz Point-of-Load Converter
Ruaidhrí E Murphy (University College Cork & Tyndall National Institute, Ireland); Paul McCloskey, Seamus O'Driscoll and Cian Ó Mathúna (Tyndall National Institute, Ireland); Gerald Weidinger (AT&S, Austria); Zoran Pavlovic (Tyndall National Institute, Ireland)
Design of Interleaved GaN transistor based Buck Converter with Directly Coupled Foil Winding Inductor
Kaspars Kroics (Riga Technical University, Latvia)
Influence of the winding arrangement of inductors on transient voltage distribution at high dv/dt values
Lukas Reißenweber and Alexander Stadler (Coburg University of Applied Sciences and Arts, Germany)
Investigation on static and dynamic behavior of integrated current sensor in Automotive IGBT module with SPICE based model
Shinichiro Adachi (Fuji Electric.,co Ltd); De Doncker Rik W. (RWTH Aachen University, Germany)
Improved Performances of 6,5kV IGBT Module by using Current Source Gate Driver
Vincent Escrouzailles (ALSTOM SA, France); Eric Rabasse and Jean-Yves Coiret (Alstom, France)
A General Model Translation Approach for Vertical Power MOSFETs Based on BSIM3 Model
Lixi Yan and Ingmar Kallfass (University of Stuttgart, Germany)
Study and Design of an Integrated CMOS Laser Diode Driver for an iToF-based 3D Image Sensor
Romain David (University of Lyon & STMicroelectronics, France); Xavier Branca (STMicroelectronics, France); Bruno Allard (INSA Lyon, France); Charles Joubert (Academia, France)

Poster Session General Aspects of Packaginggo to top

Application of Neural Networks to Accelerate Thermomechanical Simulations of Power Modules
Javier Acuna and Ingmar Kallfass (University of Stuttgart, Germany); Thomas Rupp, Marcus Sonner and Markus Klingler (Robert Bosch GmbH, Germany); Valentyna Afanasenko (University of Stuttgart, Germany)
Deformation Measurements during Active Operation of Power Modules with Novel Assembly and Packaging Technology
Alexander Schiffmacher and Arben Qelibari (University of Freiburg - IMTEK, Germany); Jacek Rudzki and Frank Osterwald (Danfoss Silicon Power GmbH, Germany); Jürgen Wilde (Universität Freiburg - IMTEK, Germany)
Paste Processing and Structural Properties of Copper Metal-Matrix Composites Containing Short Carbon Fibers
Helge Wurst, Thomas Blank, Benjamin Leyrer and Marc Weber (Karlsruhe Institute of Technology, Germany)
Thermal simulation for power density optimization of SiC-MOSFET drive train inverters
Nathalie Becker (Ilmenau University of Technology, Germany); Reinhard Herzer, Roland Bittner and Sandro Bulovic (SEMIKRON Elektronik GmbH & Co. KG, Germany)
Experimental Analysis and Modeling of Bond Formation in Ultrasonic Thick Wire Bonding
Reinhard Schemmel (University of Paderborn, Germany); Claus Scheidemann (Universität Paderborn, Germany); Tobias Hemsel (Paderborn University, Germany); Walter Sextro (Universität Paderborn, Germany); Olaf Kirsch (Infineon Technologies AG Warstein, Germany)
Influence of process and stress conditions on microstructure and failure mechanisms of 2nd level sintered Ag joints
Constanze Weber and Matthias Hutter (Fraunhofer IZM, Germany); Martin Schneider-Ramelow (Fraunhofer IZM & TU Berlin, Germany)
Copper wire bonding process characterization and simulation
Alberto AM Mancaleoni (STMicroelectronics); Alessandro Sitta (STMicroelectronics & Universita' degli Studi di Catania, Italy); Alexandra Colombo and Riccardo Villa (STMicroelectronics, Italy); Giuseppe Mirone (University of Catania, Italy); Marco Renna and Michele Calabretta (STMicroelectronics, Italy)

Poster Session Mechatronic Systems and their Applicationsgo to top

Design and integration of inductive components for a high-frequency 11 kW / 800 V off-board charger for electric vehicles
Michael Schmidhuber and Christoph Drexler (SUMIDA Components & Modules GmbH, Germany); Christopher Joffe (Fraunhofer Institute for Integrated Systems and Device Technology IISB, Germany); Stefan Ditze and Stefan Ehrlich (Fraunhofer Institute for Integrated Systems and Device Technology, Germany); Bastian Arndt, Peter Olbrich and Hartwig Reindl (AVL Software and Functions GmbH, Germany)
Low-inductive SiC H-Bridge for Direct-Inverter-Single-Tooth-Integration (German BMBF Public Funded Research Project 'VERSE')
High Frequency DC-DC Converter for an Integrated Electrical Excitation of an Axial Flux Machine with Fiber-composite Rotor: a Multidisciplinary Approach
Philipp Schneider, Tobias Reimann and Benedikt Neitzel (Technische Universität Ilmenau, Germany); Andreas Moeckel (Ilmenau University of Technology, Germany); Tobias Heidrich (Technische Universität Ilmenau, Germany)

Poster Session Power Packages and Modulesgo to top

Half-bridge Concepts for High Blocking Voltage GaN HEMTs
Martin Rittner, Ulrich Kessler and Tine Konjedic (Robert Bosch GmbH, Germany); Joerg Naundorf, Kai Kriegel and Martin Schulz (Siemens AG, Germany); Gaudenzio Meneghesso (University of Padova, Italy)
Two-layered planar SiC power module for industrial applications
Oliver Raab, Kai Kriegel and Pol Ghesquiere (Siemens AG, Germany)
Characterization of the Junction Temperature of SiC Power Devices via Quasi-Threshold Voltage as Temperature Sensitive Electrical Parameter
Design, Manufacturing and Evaluation of a Highly Integrated Low Voltage High Current Inverter
Johan Le Leslé, Vincent Quemener, Julien Morrand, Rémi Perrin, Roberto Mrad and Stefan Mollov (Mitsubishi Electric R&D Centre Europe, France)
Highly Integrated Switching Cell Design based on Copper Diamond Heat Spreader, 3D Printed Heat Sink and HTCC Logic Board
Alexander Sewergin (RWTH Aachen University, Germany); Martin Rittner and Andreas Burghardt (Robert Bosch GmbH, Germany); Kai Kriegel (Siemens AG, Germany); Gerhard Mitic (Siemens, Germany); Thomas Zetterer (Schott AG, Germany); Thomas Hutsch (Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM, Germany); Albert Neumann (Austerlitz Electronic GmbH, Germany); Flaviu Simon (Fraunhofer Institute for Integrated Systems and Device Technology IISB, Germany); Rik De Doncker (RWTH Aachen University & Institute for Power Generation and Storage Systems, Germany)
PCB Embedded Transformer for Isolated DC-DC Power Supplies
Gerald Weis and Ivan Salkovic (AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Austria)
Improved Stress Distribution in Railway Traction Converters Using New High Power Half-Bridge Modules
Michel Piton (Alstom, France); Emmanuel Batista (ALSTOM, France); Vincent Escrouzailles (ALSTOM SA, France)
Double pulse vs. indirect measurement: Characterizing switching losses of integrated power modules with wide bandgap semiconductors
Adam Kuczmik (Ingenieurbüro Kuczmik, Germany); Stefan Hoffmann (Fraunhofer IZM, Germany); Eckart Hoene (Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM, Germany)
Electrical characteristics of double-sided cooling SiC power module using Ni micro plating bonding
Tomoya Itose, Akihiro Kawagoe and Akihiro Imakiire (Kyushu Institute of Technology, Japan); Masahiro Kozako and Masayuki Hikita (Kyusyu Institute of Technology, Japan); Kohei Tatsumi, Tomonori Iizuka and Isamu Morisako (Waseda University, Japan); Nobuaki Sato, Koji Shimizu and Kazutoshi Ueda (Mitsui High-tec Inc., Japan)
Application considerations for Double Sided Cooled Modules in Automotive Environment
Sebastian Möller (Virtual Vehicle Research Center, Austria); Danial Karimi (Vrije Universiteit Brussel & Flanders Make, Belgium); Omar Vanegas (Infineon Technologies AG, Germany); Mohamed El Baghdadi (Vrije Universiteit Brussels, Belgium); Alexander Kospach (Virtual Vehicle Research Center, Austria); Adrian Lis (Infineon Technologies AG, Germany); Benedikt Rabl (Virtual Vehicle Research Center, Austria); Omar Hegazy (Vrije Universiteit Brussels, Austria); Christoph Abart (AVL List GmbH, Austria)
Smart Ultrasonic Welding in Power Electronics Packaging

Poster Session Reliabilitygo to top

A Review on the Application of On-Line Von (On-State Voltage) Sensing for Junction Temperature Estimation of Power Semiconductor Modules
Nicolas Degrenne, Julio Brandelero, Chihiro Kawahara and Stefan Mollov (Mitsubishi Electric R&D Centre Europe, France)
A Method for the Characterization of Adhesion Strength Degradation of Thin Films on Si-Substrate under thermal cycling test
Dawei Zhao (Friedrich-Alexander-Universität Erlangen-Nürnberg, Germany); Sebastian Letz and Andreas Schletz (Fraunhofer Institute for Integrated Systems and Device Technology IISB, Germany); Martin März (FhG Erlangen, Germany)
Mechanical and microstructural characterization of LTCC and HTCC ceramics for high temperature and harsh environment application
Falk Naumann, Bianca Boettge, Michael Bernasch, Georg Lorenz and Jan Schischka (Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Germany); Sandy Klengel (Fraunhofer Institute for Microstructure of Materials and System, Germany); Steffen Ziesche (Fraunhofer IKTS, Germany); Hans-Fridtjof Pernau and Martin Jaegle (Fraunhofer Institute for Physical Measurement Techniques IPM, Germany); Holger Kappert (Fraunhofer institute of Microelectronic Circuits and Systems, Germany)
Introducing the LEGO Mission Profile Analysis Methodology
Martin Bendix Fogsgaard and Francesco Iannuzzo (Aalborg University, Denmark)
End-of-life mechanism due to cyclic thermomechanical loading of power modules with .XT joining technology
Torsten Methfessel and Hendrik Jähme (Infineon Technologies AG, Germany)
Microstructure And Shear Strength Correlation After Reliability Testing Of Bond Contacts Using Alternative Al Heavy Wire Materials
Robert Klengel, Jan Schischka and Tino Stephan (Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Germany); Sandy Klengel (Fraunhofer Institute for Microstructure of Materials and System, Germany); Martin Hempel (Fraunhofer Institute for Reliability and Microintegration IZM, Germany); Martin Schneider-Ramelow (Fraunhofer IZM & TU Berlin, Germany); Anne Groth (Technische Universität Berlin, Germany)
Loop formation effects on the lifetime of wire bonds for power electronics
Hans-Georg von Ribbeck (F & K DELVOTEC Bondtechnik GmbH, Germany); Torsten Döhler (TH Wildau, Germany); Bernhard Czerny and Golta Khatibi (TU Wien, Austria); Ute Geißler (TH Wildau, Germany)
Thermo-mechanical reliability of nanosilver sintered joints for large-area substrate bonding
Jingru Dai, Pearl A Agyakwa and Christopher Johnson (University of Nottingham, United Kingdom (Great Britain))

Wednesday, March 25 16:30 - 18:00

Session Reliability (1)go to top

Room 1
16:30 Reliability of Capacitors and Magnetic Components in Power Electronic Applications (Invited)
Huai Wang, Haoran Wang and Zhan Shen (Aalborg University, Denmark)
17:00 H3TRB Test on 6.5 kV SiC-JBS Diodes
Felix Hoffmann (University of Bremen, Germany); Andrei Mihaila (ABB Switzerland Ltd., Germany); Victor Soler (Centre Nacional de Microelectrònica, Spain); Nando Kaminski (University of Bremen, Germany)
17:20 Survey on Generative and Discriminative Approaches with Focus on SiC
Afshin Loghmani Moghaddam Toussi (University of Aalborg, Denmark); Amir Sajjad Bahman and Frede Blaabjerg (Aalborg University, Denmark)

Session Clean Switching, EMC (2)go to top

Room 2
16:30 High Power Density EMI Mitigation in Power Electronics Converters: Active and Integrated Solutions (Invited)
Fang Luo (University of Arkansas, U.S.)

Wednesday, March 25 19:00 - 22:00

Conference Dinner (Departure from the Venue by Bus)go to top

Thursday, March 26

Thursday, March 26 8:30 - 9:10

Keynotego to top

Room 1
8:30 Power cycling - methods, measurement accuracy, comparability
Josef Lutz (Chemnitz University of Technology, Germany)

Thursday, March 26 9:10 - 10:10

Session Reliability (2)go to top

Room 1
9:10 Comparative study of determining junction temperature of SiC MOSFETs during power cycling tests by a Tj sensor and the VSD(T)-method
Carsten Kempiak (Otto-von-Guericke-Universtität Magdeburg, Germany); Andreas Lindemann (University of Magdeburg, Germany); Shiori Idaka and Eckhard Thal (Mitsubishi Electric Europe B. V., Germany)
9:30 Power Cycling of SiC MOSFET Single-Chip Modules with Additional Measurement Cycles for Life End Determination
Felix Wagner, Gerhard Reber, Martin Rittner and Michael Guyenot (Robert Bosch GmbH, Germany); Maximilian Nitzsche (University of Stuttgart, Germany); Bernhard Wunderle (Technische Universität Chemnitz, Germany)
9:50 Impact of load-pulse duration on power-cycling capability of SiC devices
Paul Salmen (Infineon Technologies AG, Germany); Oliver Schilling (Infineon AG, Germany); Torsten Methfessel (Infineon Technologies AG, Germany); Cesare Künzel (TU Chemnitz, Germany)

Session General Aspects of Packaging (2)go to top

Room 2
9:10 PCB Embedding using Single-Switch-Pre-Packages as Modular Building Blocks
Ankit Bhushan Sharma, Johann Schnur and Niko Haag (Hochschule Kempten - University of Applied Science, Germany); Vladimir Polezhaev (Hochschule Kempten, Germany); Till Huesgen (Hochschule Kempten - University of Applied Science, Germany)
9:30 Generic thermal cooling design for multicell converters
Jean-Christophe Crebier and Yvan Avenas (Grenoble Université, France); Yves Lembeye (Grenoble Electrical Engineering Laboratory, France); André Andreta (Universite Grenoble Alpes, France)
9:50 PCB layout tool integrated loss and inductance estimation
Stefan Hoffmann (Fraunhofer IZM, Germany); Eckart Hoene (Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM, Germany); Bernd Schroeder, Bernd Stube and Akram Alraai (TU Berlin, Germany); Oliver Moritz (Enasys GmbH, Germany); Olaf Müller (AEconversion GmbH & Co. KG, Germany)

Thursday, March 26 10:10 - 10:40

Tea Breakgo to top

Thursday, March 26 10:40 - 12:00

Session Reliability (3)go to top

Room 1
10:40 IGBT current filamentation observation by segmented collector sensing under UIS condition
Seiya Matsuura (Kyusyu Institute of Technology, Japan); Masanori Tsukuda (Green Electronics Research Institute, Kitakyushu, Japan); Ichiro Omura (Kyushu Institute of Technology, Japan)
11:00 Simultaneous Imaging of Strain and Temperature using Single IR Camera
Yoshiki Masuda (Kyusyu Institute of Technology, Japan); Akihiko Watanabe and Ichiro Omura (Kyushu Institute of Technology, Japan)
11:20 Power cycling close to 50 Hz load, low temperature swings combined with an adjustable part of switching losses
Peter Seidel, Christian Schwabe and Josef Lutz (Chemnitz University of Technology, Germany)
11:40 Dynamic AC Power Cycling with Coupled Inverters Operating Under Application-Oriented Conditions
Maximilian Nitzsche, Kevin Muñoz Barón and Philipp Ziegler (University of Stuttgart, Germany); Felix Wagner (Robert Bosch GmbH, Germany); Jörg Roth-Stielow (University of Stuttgart, Germany)

Session General Aspects of Packaging (3)go to top

Room 2
10:40 Development of sinter paste for die-attach bonding, based on surface modified copper alloy particles
Gordon Elger (Technische Hochschule Ingolstadt & Institut für Innovative Mobilität, Germany)
11:00 Application of Response Surface Methodology for Optimization of Ag-Ag Direct Bonding for Wafer-Level Power Electronics Packaging
Zechun Yu and Weijian Zeng (Fraunhofer Institute for Integrated Systems and Device Technology IISB, Germany); Christoph Friedrich Bayer (Fraunhofer Institute for Integrated Systems and Device Technology, Germany); Andreas Schletz (Fraunhofer Institute for Integrated Systems and Device Technology IISB, Germany); Martin März (FhG Erlangen, Germany)
11:20 A new development of micro-copper sinter material for high power electronics application
Christian Schwarzer (Aschaffenburg University of Applied Sciences & Heraeus Deutschland GmbH & Co KG, Germany); Ly May Chew (Heraeus Deutschland GmbH & Co. KG, Germany); Thomas Stoll (Friedrich-Alexander-Universität Erlangen-Nürnberg & Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS), Germany); Jörg Franke (FAU Erlangen-Nuremberg, Germany); Michael Kaloudis (Aschaffenburg University of Applied Sciences, Germany)
11:40 Numerical material design for reliable power electronics with cement-based encapsulation
Falk Naumann and Bianca Boettge (Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Germany); Sandy Klengel (Fraunhofer Institute for Microstructure of Materials and System, Germany); Stefan Behrendt (FuE-Zentrum FH Kiel GmbH, Germany); Ronald Eisele (FH Kiel, Germany)

Thursday, March 26 12:00 - 13:30

Lunch Breakgo to top

Thursday, March 26 13:30 - 14:10

Keynotego to top

Room 1
Chair: Eckhard Wolfgang (ECPE e. V., Germany)
13:30 Present and Future of Fault Tolerant Drives applied to Transport Applications
Xu Deng, Haimeng Wu, Bowen Gu, Glynn Atkinson, Barrie Mecrow and Volker Pickert (Newcastle University, United Kingdom (Great Britain))

Thursday, March 26 14:10 - 15:00

Closing and Awards Ceremonygo to top

Room 1
Chairs: Nando Kaminski (University of Bremen, Germany), Andreas Lindemann (University of Magdeburg, Germany)