Welcome to TEMSCON 2018, authors!

Some important TEMSCON 2018 dates: Paper submissions due - 3/1/2018 (deadline extended from 2/1/2018); Notification of acceptance - 4/1/2018; Revisions due (for papers requiring revisions) - 4/15/2018; Author conference registration due - 5/1/2018; Final papers due - 5/1/2018.

Please note: Acceptance to present at TEMSCON 2018 will be based on a full-paper review (not an abstract review). All papers should follow the IEEE manuscript template for conference proceedings, found at https://www.ieee.org/conferences_events/conferences/publishing/templates.html. Please use the US letter format, only. The maximum font size allowed is 10. Papers no longer than 6 pages are highly encouraged. 7-page and 8-page papers are allowed, with a charge of $100/page greater than 6. Papers longer than 8 pages will be rejected without review. Manuscripts should not contain page numbers, headers or footers, in 2-column format. For PDFs, use PDF/A format, fonts must be embedded, with no bookmarks, and no hyperlinks (URL in text OK).

We look forward to your valuable contributions!

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