Program for CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems

Time Room 1 Room 2 Session

Tuesday, February 25

10:30 am-10:50 am Opening and Keynotes    
10:50 am-12:40 pm S01: Reliability (1)    
12:40 pm-02:00 pm     Lunch
02:00 pm-03:40 pm S02: Reliability (2)    
03:40 pm-04:10 pm     Coffee Break
04:10 pm-05:30 pm S03: Reliability (3)    
05:30 pm-05:40 pm     Break
05:40 pm-07:10 pm S04: Reliability (4)    
07:10 pm-07:30 pm     Break
07:30 pm-10:00 pm     Dialog Session & Frankonian Snacks and Beverages,
Dialog Session: Inverters, Converters, Drivers,
Dialog Session: Packaging,
Dialog Session: Reliability, Design Tools,
Dialog Session: Wide Band Gap Packaging

Wednesday, February 26

08:50 am-10:20 am S05: Inverters, Converters S06: Interfaces and Substrates  
10:20 am-10:50 am     Coffee Break
10:50 am-12:30 pm S07: Inverters, Converters, Drivers S08: Interconnects  
12:30 pm-02:00 pm     Lunch
02:00 pm-03:50 pm S09: Overview: EMI: Renewables, Sensors    
03:50 pm-04:20 pm     Coffee Break
04:20 pm-05:40 pm S10: Lifetime and Robustness    
07:15 pm-11:00 pm     Conference Dinner

Thursday, February 27

09:00 am-10:00 am S11: Power Modules    
10:00 am-10:30 am     Coffee Break
10:30 am-12:10 pm S12: Wide Band Gap (1)    
12:10 pm-01:30 pm     Lunch
01:30 pm-03:10 pm S13: Wide Band Gap (2)    
03:10 pm-03:30 pm Closing    

Tuesday, February 25

Tuesday, February 25, 10:30 - 10:50

Opening and Keynotes

Room 1
Chairs: Leo Lorenz (ECPE, Germany), Dieter Silber (Bremen University, Germany), Eckhard Wolfgang (ECPE e. V., Germany)

Tuesday, February 25, 10:50 - 12:40

S01: Reliability (1)

Room 1
Chairs: Leo Lorenz (ECPE, Germany), Eckhard Wolfgang (ECPE e. V., Germany)
10:50 Keynote: What are the big challenges in PE
Johann. W. Kolar (ETH Zurich, Switzerland)
11:30 Invited: Packaging and Reliability of Power Modules
Josef Lutz (Chemnitz University of Technology, Germany)
12:00 High-throughput DBC-assembled IGBT screening for power module
Masanori Tsukuda (The International Centre for the Study of East Asian Development & Kyushu Institute of Technology, Japan); Seiichi Okoda (Coper Electronics co. ltd, Japan); Noda Ryuzo (C. D. N. Corporation, Japan); Katsuji Tashiro (HOH KOH SYA Co., Ltd., Japan); Ichiro Omura (Kyushu Institute of Technology, Japan)
12:20 Simultaneous Testing of Wirebond and Solder Fatigue in IGBT Modules
Gernot J Riedel and Maria Valov (ABB Corporate Research, Switzerland)

Tuesday, February 25, 12:40 - 14:00

Lunch

Tuesday, February 25, 14:00 - 15:40

S02: Reliability (2)

Room 1
Chairs: Christian Conrath (Schneider-Electric, STIE & Schneider Electric, France), Josef Lutz (Chemnitz University of Technology, Germany)
2:00 Power cycling capability of Modules with SiC-Diodes
Christian Herold (Chemnitz University of Technology, Germany); Marc Schäfer and Frank Sauerland (Infineon AG, Germany); Tilo Poller and Josef Lutz (Chemnitz University of Technology, Germany); Oliver Schilling (Infineon AG, Germany)
2:20 A real time measurement of junction temperature variation in high power IGBT modules for wind power converter application
Pramod Ghimire (Aalborg University, Denmark)
2:40 Thermal path integrity monitoring for IGBT Power Electronics Modules
Amir Eleffendi and C Mark Johnson (University of Nottingham, United Kingdom (Great Britain))
3:00 Reliability assessment of molded Smart Power Modules
Tina Thomas (Technische Universität Berlin, Germany); Karl-Friedrich Becker, Tanja Braun and Joerg Bauer (Fraunhofer IZM, Germany); Klaus-Dieter Lang (Fraunhofer, Germany); Olaf Wittler and Rolf Aschenbrenner (Fraunhofer IZM, Germany)
3:20 Microstructural study of the fatigue mechanism of aluminum cladded copper wires
Falk Naumann (Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Germany); Benjamin Maerz (Fraunhofer Institute for Mechanics of Materials IWM, Germany); Jan Schischka (Fraunhofer Institute for Mechanics of Materials, Germany); Matthias Petzold (Fraunhofer-Institut für Werkstoffmechanik, Germany)

Tuesday, February 25, 15:40 - 16:10

Coffee Break

Tuesday, February 25, 16:10 - 17:30

S03: Reliability (3)

Room 1
Chairs: Stefan Linder (Alpiq, Switzerland), Norbert Seliger (FH Rosenheim, Germany)
4:10 Aging of new Interconnect-Technologies of Power Modules during Power-Cycling
Nicolas Heuck and Karsten Guth (Infineon Technologies AG, Germany); Alexander Ciliox (Infineon Technologies, Germany); Markus Thoben (Infineon Technologies AG, Germany); Niels Oeschler (Infineon Technologies, Germany); Sandra Krasel (InfineonTechnologies, Germany); Roland Speckels and Lars Böwer (Infineon Technologies, Germany); Alexander Müller (Infineon Technologies AG, Germany)
4:30 High resolution failure analysis of silver-sintered contact interfaces for power electronics
Bianca Böttge (Fraunhofer Institute for Mechanics of Materials IWM); Benjamin Maerz (Fraunhofer Institute for Mechanics of Materials IWM, Germany); Jan Schischka (Fraunhofer Institute for Mechanics of Materials, Germany); Sandy Klengel (Fraunhofer Institute for Microstructure of Materials and System, Germany); Matthias Petzold (Fraunhofer-Institut für Werkstoffmechanik, Germany)
4:50 An x-ray computed tomography study of crack development during thermal cycling of Al wire bonds
Pearl A Agyakwa, Li Yang, Martin Corfield and C Mark Johnson (University of Nottingham, United Kingdom (Great Britain))
5:10 Probabilistic model based analysis of electrolytic capacitor ageing and failures in a single-phase power factor correction circuit
Norbert Seliger (FH Rosenheim, Germany)

Tuesday, February 25, 17:30 - 17:40

Break

Tuesday, February 25, 17:40 - 19:10

S04: Reliability (4)

Room 1
Chairs: Dushan Boroyevich (Virginia Tech, USA), Uwe Scheuermann (Semikron Elektronik GmbH & Co. KG, Germany)
5:40 Invited: Transient hygro-thermal-response of power modules in inverters -mission profiling for climate and power loading
Reinhold Bayerer, Matthias Lassmann and Sebastian Kremp (Infineon Technologies AG, Germany)
6:10 Temperature Humidity Bias (THB) Testing on IGBT Modules at High Bias Levels
Christian Zorn (University of Bremen & IALB, Germany); Nando Kaminski (University of Bremen, Germany)
6:30 Keynote: Simulation and Test Vibration
Das Gupta (CALCE, USA); Cholmin Choi (UIniversity of Maryland, USA); Ed Habtour (US Army Resaearh Lab, USA)

Tuesday, February 25, 19:10 - 19:30

Break

Tuesday, February 25, 19:30 - 22:00

Dialog Session & Frankonian Snacks and Beverages

Dialog Session: Inverters, Converters, Drivers

Chairs: Tobias Reimann (Technische Universität Ilmenau, Germany), Volker Pickert (Newcastle University, United Kingdom (Great Britain))
Development of a New 1000V/1MVA IGBT 3L-NPC-VSC PEBB Type 2 with Independent Modulation, DC-Link Balancing and Short-Circuit Protection
Ingo Staudt (SEMIKRON Elektronic GmbH & Co. KG, Germany); Michael Sprenger (Technische Universitaet Dresden, Germany)
Switching Frequency Limitation of Three-Phase PWM Inverter using Si-MOSFETs and SiC-SBDs
Keiji Wada (Tokyo Metropolitan University, Japan)
A proposal of embedded SoC power supply compatible with a digital block design flow
Thomas Souvignet (INSA Lyon & STMicroelectronics, France); Bruno Allard (INSA Lyon, France); Severin Trochut and Frederic Hasbani (STMicroelectronics, France)
Ultra-low Power Autonomous Power Management System with Effective Impedance Matching for RF Energy Harvesting
Salah-Eddine Adami and Christian Vollaire (Ampere Lab, France); Bruno Allard (INSA Lyon, France); Francois Costa (SATIE, France); Walid Haboubi (Marne-la-Vallée University, France); Laurent Cirio (Université de Paris-Est Marne-la-Vallée, France)
GaN Power Semiconductors for PV inverter applications - opportunities and risks
Thorsten Stubbe (SMA Solar Technology AG, Germany); Regine Mallwitz (Technische Universität Braunschweig, Germany); Mike Kunze (MicroGaN GmbH, Germany); Wolfgang Bergner, Oliver Häberlen and Gianmauro Pozzovivo (Infineon Technology AG Austria, Austria)
Design of Photovoltaic Microinverter for Off-Grid and Grid-Parallel Applications
An Improved Method of Controlling IGBT Modules Using an Optimized Gate Current Waveform
Marius Cenusa, Gabriel Cretu and Martin Pfost (Reutlingen University, Germany)
Impact of the control on the size of the output capacitor in the integration of buck converters
Jorge Cortes, Vladimir Svikovic, Pedro Alou and Jesus Oliver (Universidad Politecnica de Madrid, Spain); Jose A. Cobos (Universidad Politécnica de Madrid (UPM), Spain)

Dialog Session: Packaging

Chairs: Jürgen H. Wilde (Albert-Ludwigs-Universität Freiburg, Germany), C Mark Johnson (University of Nottingham, United Kingdom (Great Britain)), Jelena Popovic (Delft University of Technology, The Netherlands)
Improving the bond strength of sinter joints by modifying the DBC without noble finishes and modified silver sinter pastes
Alexander Roth (KCC Corporation, Germany); Wolfgang Schmitt (Heraeus Materials Technology Gmbh & Co. KG, Germany)
Power Semiconductors Packaging in PV Inverters up to 30kW power, a difficult choice
Juliane Hinze (University of Kassel, Germany); Jens Friebe (SMA Solar Technology AG, Germany); Peter Zacharias and Samuel Araujo (Universität Kassel, Germany); Torsten Leifert (SMA Solar Technology AG, Germany)
Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding
Andreas Unger (University of Paderborn, Germany); Walter Sextro, Simon Althoff and Tobias Meyer (Universität Paderborn, Germany); Michael Brökelmann (Hesse GmbH, Germany); Felix Reinhart and Klaus Neumann (Universität Bielefeld, Germany); Karsten Guth and Daniel Bolowski (Infineon Technologies AG, Germany)
Influence of nickel-phosphorus surface roughness on both wettability and pores formation in solder joints for high power electronic applications
Laurent Vivet and Ky Lim Tan (Valeo, France); Jean Michel Morelle (VALEO & GEEDS, France)
Demands for Destructive and Non-destructive Evaluation of Sintered Interconnects
Hans-Jürgen Albrecht (Siemens AG, Germany)
Surface Profiles of Printed Ag Nanoparticle Paste and Their Implication on the Quality of Sintered Joints
Yun Wang (Nottingham University, United Kingdom (Great Britain)); Jianfeng Li (University of Nottingham, United Kingdom (Great Britain)); Pearl Agyakwa (Nottingham University, United Kingdom (Great Britain)); C Mark Johnson (University of Nottingham, United Kingdom (Great Britain)); Shuguang Li (Nottingham University, United Kingdom (Great Britain))
Developments for Copper-Graphite Composite Thermal Cores PCBs for High-Reliability RF Systems
David Saums (DS&A LLC, USA)
Robustness study of solder joints of different compositions by using
Younes Aoues (INSA Rouen- LOFIMS, France)

Dialog Session: Reliability, Design Tools

Chairs: Giovanni Breglio (University Naples, Italy), Nando Kaminski (University of Bremen, Germany)
Internal degradation monitoring of power devices during power cycling test
Akihiko Watanabe (Kyushu Institute of Technology, Japan); Masanori Tsukuda (The International Centre for the Study of East Asian Development & Kyushu Institute of Technology, Japan); Ichiro Omura (Kyushu Institute of Technology, Japan)
Characterization of different wire bonding materials during passive thermal test
Fernando Cosiansi (Politecnico of Turin, Italy); Marcello Turnaturi and Emilio Mattiuzzo (Vishay Semiconductor Italiana, Italy); Steffen Koetter (Heraeus, Germany); Sven Thomas (Heraeus, Italy)
Manufacturability and Reliability Assessment of Power Sandwich Technology
Ivan Josifovic (Delft University of Technology, The Netherlands); Till Huesgen and Elena Mengotti (ABB Corporate Research, Switzerland); Jelena Popovic and Braham Ferreira (Delft University of Technology, The Netherlands); Uwe Drofenik (ABB Corporate Research, Switzerland)
Reliability Prediction Approach of DC-DC Converter with Electrical Stress Analysis
Jemin Kim and SungSoon Choi (Korea Electronics Technology Institute, Korea); Kwan-hun Lee (Kwangwoon University, Korea)
A Multi-Disciplinary Virtual Prototyping Design Tool for Power Electronics
Paul L Evans (University of Nottingham, United Kingdom (Great Britain)); Alberto Castellazzi (University of Nottingham & Power Electronics, Machines and Control Group, United Kingdom (Great Britain)); C Mark Johnson (University of Nottingham, United Kingdom (Great Britain))

Dialog Session: Wide Band Gap Packaging

Chairs: Martin Schneider-Ramelow (Fraunhofer IZM, Germany), Peter Zacharias (Universität Kassel, Germany)
Evolution of Electrical Performance in New Generation of SiC MOSFET for High Temperature Applications
Remy Ouaida (Université Lyon1 & Thales TMI, France)
Technology, industry and market trends in WBG power module packaging
Philippe Roussel (Yole Developpement, France)
Novel Layout and Packaging for Lateral, Low-Resistance GaN-on-Si Power Transistors
Richard Reiner (IAF Fraunhofer, Germany); Patrick Waltereit (Fraunhofer IAF, Germany); Fouad Benkhelifa (IAF Fraunhofer, Germany); Herbert Walcher (Fraunhofer Institute for Applied Solid State Physics, Germany); Rüdiger Quay and Michael Schlechtweg (Fraunhofer IAF, Germany); Oliver Ambacher (Fraunhofer IAF & IMTEK, University Freiburg, Germany)
High Temperature Discrete Integrated Coreless Signal Insulator
Dominique Bergogne (Ampere Lab, France); Khalil El Falahi (Ampere Lab & INSA Lyon, France); Hilal Ezzeddine (STMicroelectronics, France); Christian Martin (Univ Lyon, UCB Lyon 1, CNRS, AMPERE, France); Bruno Allard (INSA Lyon, France)
Investigation on AlCu clad base plates and a new by-pass cooler con-cept for pin fin Power modules
Andre Uhlemann (Infineon Technologies AG, Germany); Erwin Hymon (Infineon Techologies AG, Germany); Thorsten Fath (Infineon Technologies AG, Germany)
Thermal/ Power insert for efficient heat removal and power delivery
Dominic Gschwend (IBM Research Zurich & ETH Zurich, Switzerland); Timo Thick (IBM Research Zurich, Switzerland); Stefano Oggioni (IBM ISC Eng., Italy); Stephan Paredes (IBM Research Zurich, Switzerland); Keiji Matsumoto (IBM-Japan, Japan); Manish Tiwari and Dimos Poulikakos (ETH Zurich, Switzerland); Thomas Brunschwiler (IBM Research - Zurich, Switzerland)
A Simple Method to Evaluate Substrate Layout for Power Modules
Nan Zhu and Min Chen (Zhejiang University, P.R. China); Dehong Xu (Zhe Jiang University, P.R. China)
Planar, double-layer magnetic inductors for low power, high frequency dc-dc converters
Elias Laforge (Tyndall National Institute, Ireland); Christian Martin (Univ Lyon, UCB Lyon 1, CNRS, AMPERE, France); Charles Joubert (Academia, France); Bruno Allard (INSA Lyon, France); Cyril Buttay (Université de Lyon Laboratoire Ampere CNRS UMR 5005 & Insa de Lyon, France); Tony Abi Tannous (INSA Lyon, France); Pascal Bevilacqua (INSA de Lyon, France)

Wednesday, February 26

Wednesday, February 26, 08:50 - 10:20

S05: Inverters, Converters

Room 1
Chairs: Braham Ferreira (Delft University of Technology, The Netherlands), Regine Mallwitz (Technische Universität Braunschweig, Germany)
8:50 Invited: Power Supply With Integrated PassivEs-POWERSWIPE
Cian Ó Mathúna (Tyndall National Institute, Ireland)
9:20 Review of high frequency, highly integrated inductive DC-DC converters
Florian Neveu (INSA Lyon, France); Christian Martin (Univ Lyon, UCB Lyon 1, CNRS, AMPERE, France); Bruno Allard (INSA Lyon, France)
9:40 Low-inductive inverter concept by 200A / 1200V half bridge in EasyPACK 2B - following strip-line design
Christian R. Müller and Reinhold Bayerer (Infineon Technologies AG, Germany)
10:00 Losses Comparison of Gallium Nitride and Silicon Transistors in a High Frequency Boost Converter
Wenbo Wang (Delft University of Technology, The Netherlands); Frans Pansier (NXP Semiconductors, The Netherlands); Sjoerd de Haan and Braham Ferreira (Delft University of Technology, The Netherlands)

S06: Interfaces and Substrates

Room 2
Chairs: Martin Rittner (Robert Bosch GmbH, Germany), Olaf Wittler (Fraunhofer IZM, Germany)
8:50 Invited: Practical Aspects of Testing Methods for Thermal Interface Materials
David Saums (DS&A LLC, USA)
9:20 High Temperature Compatibility of Interface between Al Ribbon and Au finished DBC Substrate
Semin Park, Shijo Nagao and Katsuaki Suganuma (Osaka University, Japan)
9:40 Improved thermal cycling reliability of ZTA DBC substrates by manipulating metallization properties
Junhee Park (KCC Corporation, Korea)
10:00 3D Packaging for vertical power devices
Nicolas Rouger (Univ. Grenoble Alpes, G2Elab CNRS); Julie Widiez, Lamine Benaissa, Bruno Imbert, Paul Gondcharton and Bastien Letowski (CEA Leti, France); Jean-Christophe Crebier (Grenoble Université, France)

Wednesday, February 26, 10:20 - 10:50

Coffee Break

Wednesday, February 26, 10:50 - 12:30

S07: Inverters, Converters, Drivers

Room 1
Chair: Rainer Marquardt (Universität der Bundeswehr München, Germany)
10:50 Scalable high frequency converters for drives based on switching cells
Martin Schulz (Universität der Bundeswehr & ITIS GmbH - Marquardt, Germany); Florian Kapaun and Rainer Marquardt (Universität der Bundeswehr München, Germany)
11:10 Flexible switching speed control to improve switching losses and EMI by a gate driver with adjustable gate current
Julia Bauch (Otto-von-Guericke-University Magdeburg, Germany); Andreas Lindemann (University of Magdeburg, Germany)
11:30 Integrated gate driver circuits with an ultra-compact design and high level of galvanic isolation for power transistors
Duc To (Grenoble Electrical Engineering Laboratory, France); Nicolas Rouger (CNRS, G2Elab & University Grenoble Alpes, France); Jean-Daniel Arnould (IMEP-LAHC Laboratory, France); Yves Lembeye (Grenoble Electrical Engineering Laboratory, France)
11:50 Controlling of Power Electronic Modules by a 2-Wire-Connection with Combined Signal and Power Transfer
Stefan Endres (Fraunhofer IISB, Germany); Stefan Zeltner (Fraunhofer Institut fuer Integrierte Systeme und Bauelementetechnologie IISB, Germany)

S08: Interconnects

Room 2
Chairs: Bruno Allard (INSA Lyon, France), Jürgen Schuderer (ABB Corporate Research, Switzerland)
10:50 Foil based transient liquid phase bonding as a die-attachment method for high temperature devices
Adeel Ahmad Bajwa (University of California Los Angeles, USA); Yangyang Qin (Albert-ludwigs University of Freiburg & Imtek, Germany); Roderich Zeiser (University of Freiburg, Germany); Jürgen Wilde (Universität Freiburg - IMTEK, Germany)
11:10 Partial transient liquid phase bonding for high-temperature power electronics using Sn/Zn/Sn sandwich structure solder
Sungwon Park, Shijo Nagao and Tohru Sugahara (Osaka University, Japan); Yoshitaka Katoh, Hiroshi Ishino and Kazuhiko Sugiura (Denso Corporation, Japan); Katsuaki Suganuma (Osaka University, Japan)
11:30 Application of Silver Nano Particle to Pressureless Bonding onto a Copper Surface- Consideration of Substitute Material for Lead Solder
Hiromasa Miyoshi, Satoru Kurita and Keiichi Endoh (DOWA Electronics Materials, Japan)
11:50 Reliability of Sn based LT-TLPS Joints for High Temperature Electronic Systems
Hannes Greve (University of Maryland & CALCE - Center for Advanced Life Cycle Engineering, USA); Patrick McCluskey (University of Maryland, USA)
12:10 Is Conductive Adhesive Bonding Suited for the Die-Attachment of Power Devices?
Jürgen Wilde (Universität Freiburg - IMTEK, Germany)

Wednesday, February 26, 12:30 - 14:00

Lunch

Wednesday, February 26, 14:00 - 15:50

S09: Overview: EMI: Renewables, Sensors

Room 1
Chairs: Andreas Lindemann (University of Magdeburg, Germany), Jean-Luc Schanen (Grenoble Electrical Engineering Laboratory, France)
2:00 Invited: EMI and Integration
Dushan Boroyevich (Virginia Tech, USA)
2:30 Invited: Power Electronics - Key Technology for Renewable Energy Systems - Status and Future
Frede Blaabjerg (Aalborg University, Denmark)
3:00 Invited: New applications in power electronics for integrated high-speed magneto-resistive current sensors
Simon Scherner and Rolf Slatter (Sensitec GmbH, Germany)
3:30 System Integration of GaN Converters - Paradigm Shift, Challenges and Opportunities
Jelena Popovic and Braham Ferreira (Delft University of Technology, The Netherlands); Jacobus Daan van Wyk (University of Johannesburg, South Africa); Frans Pansier (NXP Semiconductors, The Netherlands)

Wednesday, February 26, 15:50 - 16:20

Coffee Break

Wednesday, February 26, 16:20 - 17:40

S10: Lifetime and Robustness

Room 1
Chairs: Frede Blaabjerg (Aalborg University, Denmark), Giovanni Busatto (University of Cassino, Italy)
4:20 Efficient online-algorithm for the temperature-cycle recording of an IGBT power module in a hybrid car during inverter operation
Marco Denk and Mark Bakran (University of Bayreuth, Germany)
4:40 Analyzing the state of health of diode layers by using structure functions
Martin Richter (Chemnitz University of Technology & Robert Bosch GmbH, Germany); Michael Kopp and Rüdiger Schroth (Robert Bosch GmbH, Germany); Josef Lutz (Chemnitz University of Technology, Germany)
5:00 Electro - Thermal Simulations and Experimental Results on the Surge Current Capability of 1200 V SiC MPS Diodes
Susanne Fichtner, Josef Lutz and Thomas Basler (Chemnitz University of Technology, Germany); Roland Rupp and Rolf Gerlach (Infineon Technologies AG, Germany)
5:20 A New Rainflow - free Method to Transfer Irregular Load Mission Profile Data Into appropriate Lab Test Conditions for Design Optimization
Andreas Aal (Volkswagen AG, Germany)

Wednesday, February 26, 19:15 - 23:00

Conference Dinner

Thursday, February 27

Thursday, February 27, 09:00 - 10:00

S11: Power Modules

Room 1
Chairs: Thomas Licht (Hochschule Düsseldorf, Germany), Jean Michel Morelle (VALEO & GEEDS, France)
9:00 Power Modules with increased power density and reliability using Cu wire bonds on sintered metal buffer layers
Jacek Rudzki (Danfoss Silicon Power GmbH, Germany); Martin Becker and Ronald Eisele (FH Kiel, Germany); Max Poech (Fraunhofer Institut für Siliziumtechnologie, Germany); Frank Osterwald (Danfoss Silicon Power GmbH, Germany)
9:20 New power-module structures consisting of both Cu and Al bonded to AlN substrates with an Al base plate
Nobuyuki Terasaki, Yoshiyuki Nagatomo, Toshiyuki Nagase and Yoshirou Kuromitsu (Mitsubishi Materials Corporation, Japan)
9:40 Breakthrough into the third dimension - Sintered multi layer flex for ultra low inductance power modules
Peter Beckedahl (SEMIKRON International GmbH, Germany); Matthias Spang (Semikron, Germany); Oliver Tamm (SEMIKRON Elektronik GmbH & Co. KG, Germany)

Thursday, February 27, 10:00 - 10:30

Coffee Break

Thursday, February 27, 10:30 - 12:10

S12: Wide Band Gap (1)

Room 1
Chair: Peter Friedrichs (Infineon, Germany)
10:30 Influence of Cu/Ni(P) Metallized Si3N4 Ceramic Substrate in Bond Reliability of Power Components at 250 °C
Fengqun Lang (National Institute of Advanced Industrial Science and Technology (AIST), Japan)
10:50 DCB-based low-inductive SiC modules for high frequency operation
Michael Meisser (Karlsruhe Institute of Technology, Germany); Dean Hamilton and Phil Mawby (University of Warwick, United Kingdom (Great Britain))
11:10 1200 V-360 A SiC Power Module with Phase Leg Clustering Concept for Low Parasitic Inductance and High Speed Switching
Kazuto Takao (Toshiba Corp, Japan); Takashi Shinohe (Toshiba Corpora-tion, Japan)
11:30 Comparison of thermo-mechanical reliability of high-temperature bonding materials for attachment of SiC devices
Jianfeng Li (University of Nottingham, United Kingdom (Great Britain)); Imran Yaqub (University of Nottingham & Dynex Semiconductor Ltd., United Kingdom (Great Britain)); Martin Corfield, Pearl A Agyakwa and C Mark Johnson (University of Nottingham, United Kingdom (Great Britain))
11:50 the public funded joint project "ProPower"
Martin Rittner (Robert Bosch GmbH, Germany)

Thursday, February 27, 12:10 - 13:30

Lunch

Thursday, February 27, 13:30 - 15:10

S13: Wide Band Gap (2)

Room 1
Chairs: Gerhard Miller (Infineon Technologies AG, Germany), Dieter Silber (Bremen University, Germany)
1:30 Invited: Packaging very fast switching power semiconductors
Eckart Hoene (Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM, Germany); Andreas Ostmann and Christoph Marczok (Fraunhofer IZM, Germany)
2:00 Invited: SiC Power Electronics
Hans-Peter Nee (KTH Royal Institute of Technology & EES/E2C, Sweden); Jacek Rabkowski (Warsaw University of Technology, Poland); Dimosthenis Peftitsis (KTH Royal Institute of Technology, Sweden)
2:30 Keynote: GaN device and system integration
Daisuke Ueda (Panasonic, Japan)

Thursday, February 27, 15:10 - 15:30

Closing

Room 1
Chairs: Leo Lorenz (ECPE, Germany), Dieter Silber (Bremen University, Germany), Eckhard Wolfgang (ECPE e. V., Germany)